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LCB717S

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R01
LCB717
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
0.15
0.16
0.17
0.18
0.19
0.20
0.21
0.22
Typical On-Resistance vs. Temperature
AC/DC Configuration
(I
F
=0mA, I
L
=750mA)
Load Voltage (V)
-0.3 -0.2 -0.1 0.0 0.1 0.2 0.3
Load Current (A)
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
Typical Load Current vs. Load Voltage
AC/DC Configuration
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (A)
0.6
0.8
1.0
1.2
1.4
1.6
Maximum Load Current vs. Temperature
AC/DC Configuration
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
0.030
0.035
0.040
0.045
0.050
0.055
0.060
0.065
Typical On-Resistance vs. Temperature
DC-Only Configuration
(I
F
=0mA, I
L
=1.5A)
Load Voltage (V)
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14
Load Current (A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Typical Load Current vs. Load Voltage
DC-Only Configuration
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (A)
1.0
1.5
2.0
2.5
3.0
3.5
Maximum Load Current vs. Temperature
DC-Only Configuration
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
5
10
15
20
25
30
35
40
Leakage Current vs. Temperature
Measured Across Pins 4 & 6
(I
F
=4mA, V
L
=30V)
Load Voltage (V)
0 5 10 15 20 25
Output Capacitance (pF)
100
200
300
400
500
600
700
800
Output Capacitance vs. Load Voltage
(I
F
=2mA, f=1MHz)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
1
2
3
4
5
6
Energy Rating Curve
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (V
P
)
37
38
39
40
41
42
43
44
Typical Blocking Voltage
vs. Temperature
(I
F
=4mA)
I
NTEGRATED
C
IRCUITS
D
IVISION
LCB717
www.ixysic.com
5
R01
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LCB717 / LCB717S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LCB717 / LCB717S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R01
LCB717
Mechanical Dimensions
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
LCB717
LCB717S
P1-P3P4-P6P7-P7

LCB717S

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SSR RELAY SPST-NC 1.5A 0-30V
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