NCP186
www.onsemi.com
2
Figure 2. Internal Block Diagram
IN
EN
OUT
GND
VOLTAGE REFERENCE
AND
SOFT−START
FB
0.7 V
THERMAL
SHUTDOWN
VOLTAGE REFERENCE
AND
SOFT−START
0.7 V
THERMAL
SHUTDOWN
NCP186A (with output discharge) NCP186B (without output discharge)
IN
EN
OUT
GND
FB
Table 1. PIN FUNCTION DESCRIPTION
Pin No. XDFN6 Pin Name Description
1
OUT LDO output pin
2
3 N/C Not internally connected. This pin can be tied to the ground plane to improve thermal dissipation.
4 FB Feedback input pin
5 GND Ground pin
6 EN Chip enable input pin (active “H”)
7
IN Power supply input pin
8
EPAD EPAD It’s recommended to connect the EPAD to GND, but leaving it open is also acceptable
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) IN −0.3 to 6.0 V
Output Voltage OUT −0.3 to V
IN
+ 0.3 V
Chip Enable Input EN −0.3 to 6.0 V
Output Current I
OUT
Internally Limited mA
Maximum Junction Temperature T
J(MAX)
150 °C
Storage Temperature T
STG
−55 to 150 °C
ESD Capability, Human Body Model (Note 2) ESD
HBM
2000 V
ESD Capability, Machine Model (Note 2) ESD
MM
200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78
Table 3. THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Resistance, Junction−to−Air, XDFN8 1.2 mm x 1.6 mm
R
q
JA
111 °C/W
