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MC74LVX259DR2

P1-P3P4-P6P7-P9P10-P10
MC74LVX259
http://onsemi.com
4
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
Positive DC Supply Voltage −0.5 to +7.0 V
V
IN
Digital Input Voltage −0.5 to +7.0 V
V
OUT
DC Output Voltage −0.5 to V
CC
+0.5 V
I
IK
Input Diode Current −20 mA
I
OK
Output Diode Current 20 mA
I
OUT
DC Output Current, per Pin 25 mA
I
CC
DC Supply Current, V
CC
and GND Pins 75 mA
P
D
Power Dissipation in Still Air SOIC Package
TSSOP
200
180
mW
T
STG
Storage Temperature Range −65 to +150 °C
V
ESD
ESD Withstand Voltage Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
>2000
>200
>2000
V
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 125°C (Note 4) 300 mA
JA
Thermal Resistance, Junction−to−Ambient SOIC Package
TSSOP
143
164
°C/W
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
V
CC
DC Supply Voltage 2.0 3.6 V
V
IN
DC Input Voltage 0 5.5 V
V
OUT
DC Output Voltage 0 V
CC
V
T
A
Operating Temperature Range, all Package Types −40 85 °C
t
r
, t
f
Input Rise or Fall Time V
CC
= 3.3 V + 0.3 V 0 100 ns/V
MC74LVX259
http://onsemi.com
5
DC CHARACTERISTICS (Voltages Referenced to GND)
V
CC
T
A
= 25°C −40°C ≤ T
A
≤ 85°C
Symbol Parameter Condition (V) Min Typ Max Min Max Unit
V
IH
Minimum High−Level
Input Voltage
2.0
3.0
3.6
0.75 V
CC
0.7 V
CC
0.7 V
CC
−
−
−
−
−
−
0.75 V
CC
0.7 V
CC
0.7 V
CC
−
−
−
V
V
IL
Maximum Low−Level
Input Voltage
2.0
3.0
3.6
−
−
−
−
−
−
0.25 V
CC
0.3 V
CC
0.3 V
CC
−
−
−
0.25 V
CC
0.3 V
CC
0.3 V
CC
V
V
OH
High−Level Output
Voltage
I
OH
= −50 A 2.0 1.9 2.0 − 1.9 −
V
Voltage
I
OH
= −50 A 3.0 2.9 3.0 − 2.9 −
I
OH
= −4 mA 3.0 2.58 − − 2.48 −
V
OL
Low−Level Output
Voltage
I
OL
= 50 A 2.0 − 0.0 0.1 − 0.1
V
Voltage
I
OL
= 50 A 3.0 − 0.0 0.1 − 0.1
I
OL
= 4 mA 3.0 − − 0.36 − 0.44
I
IN
Input Leakage Current V
IN
= 5.5 V or GND 0 to 3.6 − − ±0.1 − ±1.0 A
I
CC
Maximum Quiescent
Supply Current
(per package)
V
IN
= V
CC
or GND 3.6 1.0 1.0 2.0 − − A
AC ELECTRICAL CHARACTERISTICS Input t
r
= t
f
= 3.0 ns
T
A
= 25°C −40°C ≤ T
A
≤ 85°C
Symbol Parameter Test Conditions
Min Typ Max Min Max
Unit
t
PLH
,
t
PHL
Maximum Propagation
Delay, Data to Output
(Figures 5 and 9)
V
CC
= 2.7 V C
L
= 15pF
C
L
= 50pF
−
−
6.3
9.0
9.0
14.0
1.0
1.0
12.0
15.0
ns
(Figures 5 and 9)
V
CC
= 3.3 V ± 0.3 V C
L
= 15pF
C
L
= 50pF
−
−
5.6
8.0
8.0
12.0
1.0
1.0
11.0
14.0
t
PLH
,
t
PHL
Maximum Propagation
Delay, Address Select
to Out
p
ut
V
CC
= 2.7 V C
L
= 15pF
C
L
= 50pF
−
−
6.3
9.0
9.0
14.0
1.0
1.0
12.0
15.0
ns
to Output
(Figures 6 and 9)
V
CC
= 3.3 V ± 0.3 V C
L
= 15pF
C
L
= 50pF
−
−
5.6
8.0
8.0
12.0
1.0
1.0
11.0
14.0
t
PLH
,
t
PHL
Maximum Propagation
Delay, Enable to Output
(Figures 7 and 9)
V
CC
= 2.7 V C
L
= 15pF
C
L
= 50pF
−
−
6.3
9.0
9.0
14.0
1.0
1.0
12.0
15.0
ns
(Figures 7 and 9)
V
CC
= 3.3 V ± 0.3 V C
L
= 15pF
C
L
= 50pF
−
−
5.6
8.0
9.0
12.0
1.0
1.0
11.0
14.0
t
PHL
Maximum Propogation
Delay, Reset to Output
(Figures 7 and 9)
V
CC
= 2.7 V C
L
= 15pF
C
L
= 50pF
−
−
6.3
9.0
9.0
14.0
1.0
1.0
12.0
15.0
ns
(Figures 7 and 9)
V
CC
= 3.3 V ± 0.3 V C
L
= 15pF
C
L
= 50pF
−
−
5.6
8.0
9.0
12.0
1.0
1.0
11.0
14.0
C
IN
Maximum Input
Capacitance
− 6 10 − 10 pF
Typical @ 25°C, V
CC
= 3.3 V
C
PD
Power Dissipation Capacitance (Note 5)
30
pF
5. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC
2
f
in
+ I
CC
V
CC
.
MC74LVX259
http://onsemi.com
6
TIMING REQUIREMENTS Input t
r
= t
f
= 3.0 ns
T
A
= 25°C T
A
= ≤ 85°C
Symbol Parameter Test Conditions
Min Typ Max Min Max
Unit
t
w
Minimum Pulse Width, Reset or Enable
(Figure 8)
V
CC
= 2.7 V 4.5 − − 5.0 −
ns
(Figure 8)
V
CC
= 3.3 V ± 0.3 V 4.5 − − 5.0 −
t
su
Minimum Setup Time, Address or Data to Enable
(Figure 8)
V
CC
= 2.7 V 4.0 − − 4.0 −
ns
(Figure 8)
V
CC
= 3.3 V ± 0.3 V 3.0 − − 3.0 −
t
h
Minimum Hold Time, Enable to Address or Data
(Figure 7 or 8)
V
CC
= 2.7 V 2.0 − − 2.0 −
ns
(Figure 7 or 8)
V
CC
= 3.3 V ± 0.3 V 2.0 − − 2.0 −
t
r,
t
f
Maximum Input, Rise and Fall Times
(Figure 5)
V
CC
= 2.7 V − − 400 − 300
ns
,
(Figure 5)
V
CC
= 3.3 V ± 0.3 V − − 300 − 300
*Includes all probe and jig capacitance
Figure 5. Switching Waveform
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
OUTPUT
Q
DATA
IN
50%
t
PLH
t
PHL
t
f
GND
V
CC
50%
Figure 6. Switching Waveform
t
r
50%
50%
t
PHL
50%
t
PHL
DATA
IN
ADDRESS
SELECT
OUTPUT
Q
V
CC
GND
V
CC
GND
V
CC
GND
Figure 7. Switching Waveform Figure 8. Switching Waveform
Figure 9. Switching Waveform
50%
t
w
50%
t
PHL
DATA IN
OUTPUT Q
RESET
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GN
D
DATA IN
OUTPUT Q
ENABLE
DATA IN OR
ADDRESS
SELECT
ENABLE
V
CC
GND
V
CC
GND
t
w
t
w
50%
50% 50%
t
PHL
t
PHL
50%
50%
t
su
t
h(H)
t
h(H)
t
su
Figure 10. Test Circuit
P1-P3P4-P6P7-P9P10-P10

MC74LVX259DR2

Mfr. #:
Buy MC74LVX259DR2
Manufacturer:
ON Semiconductor
Description:
Latches 2-3.6V 8-Bit
Lifecycle:
New from this manufacturer.
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