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MC74LVX259DT

P1-P3P4-P6P7-P9P10-P10
MC74LVX259
http://onsemi.com
7
ORDERING INFORMATION
Device Package Shipping
†
MC74LVX259D SOIC−16 48 Units / Rail
MC74LVX259DG SOIC−16
(Pb−Free)
48 Units / Rail
MC74LVX259DR2 SOIC−16 2500 Tape & Reel
MC74LVX259DR2G SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LVX259DT TSSOP−16* 96 Units / Rail
MC74LVX259DTR2 TSSOP−16* 2500 Tape & Reel
MC74LVX259M SOEIAJ−16 50 Units / Rail
MC74LVX259MG SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC74LVX259MEL SOEIAJ−16 2000 Tape & Reel
MC74LVX259MELG SOEIAJ−16
(Pb−Free)
2000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
EMBOSSED CARRIER DIMENSIONS (See Notes 6 and 7)
Tape
Size
B
1
Max
D D
1
E F K P P
0
P
2
R T W
8 mm 4.35 mm
(0.179”)
1.5 mm
+ 0.1
−0.0
(0.059”
0 004
1.0 mm
Min
(0.179”)
1.75 mm
±0.1
(0.069
±0.004”)
3.5 mm
±0.5
(1.38
±0.002”)
2.4 mm
Max
(0.094”)
4.0 mm
±0.10
(0.157
±0.004”)
4.0 mm
±0.1
(0.157
±0.004”)
2.0 mm
±0.1
(0.079
±0.004”)
25 mm
(0.98”)
0.6 mm
(0.024)
8.3 mm
(0.327)
12 mm 8.2 mm
(0.323”)
(
+0.004
−0.0)
1.5 mm
Min
(0.060)
)
5.5 mm
±0.5
(0.217
±0.002”)
6.4 mm
Max
(0.252”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
)
30 mm
(1.18”)
12.0 mm
±0.3
(0.470
±0.012”)
16 mm 12.1 mm
(0.476”)
7.5 mm
±0.10
(0.295
±0.004”)
7.9 mm
Max
(0.311”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
12.0 mm
±0.10
(0.472
±0.004”)
16.3 mm
(0.642)
24 mm 20.1 mm
(0.791”)
11.5 mm
±0.10
(0.453
±0.004”)
11.9 mm
Max
(0.468”)
16.0 mm
±0.10
(0.63
±0.004”)
24.3 mm
(0.957)
6. Metric Dimensions Govern−English are in parentheses for reference only.
7. A
0
, B
0
, and K
0
are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
MC74LVX259
http://onsemi.com
8
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019

SOIC−16
D SUFFIX
CASE 751B−05
ISSUE J
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.

SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
MC74LVX259
http://onsemi.com
9
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 0.78 −−− 0.031
A
1
H
E
Q
1
L
E
10
0
10
L
E
Q
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
SOEIAJ−16
M SUFFIX
CASE 966−01
ISSUE O
P1-P3P4-P6P7-P9P10-P10

MC74LVX259DT

Mfr. #:
Buy MC74LVX259DT
Manufacturer:
ON Semiconductor
Description:
IC LATCH AADDRESS 8BIT 16-TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
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