STTH310 Characteristics
Doc ID 9346 Rev 4 3/7
Figure 5. Thermal resistance junction to ambient versus copper surface under each lead
Figure 1. Conduction losses versus
average current
Figure 2. Forward voltage drop versus
forward current
P(W)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
I (A)
F(AV)
T
δ
=tp/T
tp
δ = 1
δ = 0.05
δ = 0.5
δ = 0.2
δ = 0.1
I (A)
FM
0.1
1.0
10.0
100.0
0.0 0.5 1.0 1.5 2.0 2.5
T =25°C
(maximum values)
j
V (V)
FM
T =150°C
(maximum values)
j
T =150°C
(typical values)
j
Figure 3. Relative variation of thermal
impedance junction ambient
versus pulse duration (DO-201AD)
Figure 4. Relative variation of thermal
impedance junction ambient
versus pulse duration (SMC)
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
T
δ
=tp/T
tp
t (s)
p
Epoxy printed circuit board, FR4,
L = 10 mm
leads
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
T
δ
=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
Epoxy printed circuit board, FR4,
S = 1cm
2
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
012345
SMB
DO-201AD
L =10mm
leads
S(cm²)
Epoxy printed circuit board, FR4,
copper thickness = 35 µm