CY7C1011DV33
Document Number: 38-05609 Rev. *H Page 4 of 17
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage temperature ................................ –65 C to +150 C
Ambient temperature with
power applied .......................................... –55 C to +125 C
Supply voltage on
V
CC
to relative GND
[2]
.................................–0.3 V to +4.6 V
DC voltage applied to outputs
in high Z State
[2]
................................ –0.3 V to V
CC
+ 0.3 V
DC input voltage
[2]
............................. –0.3 V to V
CC
+ 0.3 V
Current into outputs (LOW) ........................................ 20 mA
Static discharge voltage
(per MIL-STD-883, method 3015) ...... ................... > 2001 V
Latch-up current .................................................... > 200 mA
Operating Range
Range Ambient Temperature V
CC
Industrial –40 C to +85 C 3.3 V 0.3 V
DC Electrical Characteristics
Over the Operating Range
Parameter Description Test Conditions
-10
Unit
Min Max
V
OH
Output HIGH voltage V
CC
= Min, I
OH
= –4.0 mA 2.4 V
V
OL
Output LOW voltage V
CC
= Min, I
OL
= 8.0 mA 0.4 V
V
IH
Input HIGH voltage 2.0 V
CC
+ 0.3 V
V
IL
Input LOW voltage
[3]
–0.3 0.8 V
I
IX
Input leakage current GND < V
I
< V
CC
–1 +1 A
I
OZ
Output leakage current GND < V
OUT
< V
CC
, Output Disabled –1 +1 A
I
CC
V
CC
operating supply current V
CC
= Max, f = f
MAX
= 1/t
RC
100 MHz 90 mA
83 MHz 80
66 MHz 70
40 MHz 60
I
SB1
Automatic CE Power-down
Current — TTL Inputs
Max V
CC
, CE > V
IH
,
V
IN
> V
IH
or V
IN
< V
IL
, f = f
MAX
–20mA
I
SB2
Automatic CE Power-down
Current — CMOS Inputs
Max V
CC
, CE > V
CC
– 0.3 V,
V
IN
> V
CC
– 0.3 V, or V
IN
< 0.3 V, f = 0
–10mA
Notes
2. Tested initially and after any design or process changes that may affect these parameters.
3. V
IL
(min) = –2.0 V and V
IH
(max) = V
CC
+ 2 V for pulse durations of less than 20 ns.
CY7C1011DV33
Document Number: 38-05609 Rev. *H Page 5 of 17
Capacitance
Parameter
[4]
Description Test Conditions Max Unit
C
IN
Input capacitance T
A
= 25 C, f = 1 MHz, V
CC
= 3.3 V 8 pF
C
OUT
I/O capacitance 8pF
Thermal Resistance
Parameter
[4]
Description Test Conditions TSOP II VFBGA Unit
JA
Thermal resistance
(junction to ambient)
Still air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
50.66 27.89 C/W
JC
Thermal resistance
(junction to case)
17.17 14.74 C/W
AC Test Loads and Waveforms
Figure 3. AC Test Loads and Waveforms
[5]
Note
4. Tested initially and after any design or process changes that may affect these parameters.
5. AC characteristics (except high Z) are tested using the load conditions shown in (a). High Z characteristics are tested for all speeds using the test load shown in (c).
CY7C1011DV33
Document Number: 38-05609 Rev. *H Page 6 of 17
Data Retention Characteristics
Over the Operating Range
Parameter Description Conditions
[6]
Min Max Unit
V
DR
V
CC
for data retention 2.0 V
I
CCDR
Data retention current
V
CC
= V
DR
= 2.0 V, CE > V
CC
– 0.3 V,
V
IN
> V
CC
– 0.3 V or V
IN
< 0.3 V
–10mA
t
CDR
[7]
Chip deselect to data retention
time
0–ns
t
R
[8]
Operation recovery time t
RC
–ns
Data Retention Waveform
Figure 4. Data Retention Waveform
3.0 V3.0 V
t
CDR
V
DR
> 2 V
DATA RETENTION MODE
t
R
CE
V
CC
Notes
6. No input may exceed V
CC
+ 0.3 V.
7. Tested initially and after any design or process changes that may affect these parameters.
8. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min.)
> 50 s or stable at V
CC(min.)
> 50 s.

CY7C1011DV33-10BVXI

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 2Mb 10ns3.3V 128Kx16 Fast Async SRAM
Lifecycle:
New from this manufacturer.
Delivery:
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