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LAA100STR

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R02
LAA100
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=70mA
DC
)
Temperature (ºC)
LED Current (mA)
-40
5.0
4.0
3.0
2.0
1.0
0
-20 0 20 40 60 80 100 120
Typical Turn-On vs. Temperature
(I
L
=70mA
DC
)
Temperature (ºC)
I
F
=5mA
I
F
=10mA
Turn-On (ms)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100 120
Typical On-Resistance vs. Temperature
(I
L
=120mA
DC
, One Pole Operating)
Temperature (ºC)
On-Resistance (:)
-40
30
25
20
15
10
5
0
-20 0 20 40 60 80 100 120
I
F
=5mA
Continuous Load
I
L
=Max Rated
Pulsed
I
L
=100mA
I
F
=5mA
I
F
=10mA
I
F
=10mA
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=70mA
DC
)
Temperature (ºC)
LED Current (mA)
-40
5.0
4.0
3.0
2.0
1.0
0
-20 0 20 40 60 80 100 120
Typical Turn-Off vs. Temperature
(I
L
=70mA
DC
)
Temperature (ºC)
Turn-Off (ms)
-40
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100 120
Typical On-Resistance vs. Temperature
(I
L
=120mA
DC
, Both Poles Operating)
Temperature (ºC)
On-Resistance (:)
-40
30
25
20
15
10
5
0
-20 0 20 40 60 80 100 120
I
F
=5mA
I
F
=10mA
Maximum Continuous DC Load Current
vs. Temperature
Temperature (ºC)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
One Pole Operating
Two Poles Operating
I
F
=10mA
I
F
=10mA
I
F
=5mA
I
F
=5mA
Typical Load Current vs. Load Voltage
(T
A
=25
o
C, I
F
=5mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-3 -2 -1 0 1 2 3
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (V
P
)
-40
450
440
430
420
410
400
390
380
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured across Pins 5&6, 7&8
(V
L
=350V)
Temperature (ºC)
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms
1s
10ms 10s 100s
I
NTEGRATED
C
IRCUITS
D
IVISION
LAA100
www.ixysic.com
5
R02
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LAA100 / LAA100S / LAA100P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LAA100 / LAA100S 250ºC for 30 seconds
LAA100P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R02
LAA100
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
LAA100
LAA100S
LAA100P
P1-P3P4-P6P7-P7

LAA100STR

Mfr. #:
Buy LAA100STR
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount 350V 120mA Dual Single-Pole
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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