Product Standards
Schottky Barrier Diode
DB2460100L
Technical Data ( reference )
Page 3 of 4
IF - VF
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Forward voltage VF (V)
Forward current IF (A)
Ta = 125 °C
-40 °C
25 °C
85 °C
IR - VR
1.E-09
1.E-08
1.E-07
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
0 102030405060
Reverse voltage VR (V)
Reverse current IR (A)
Ta = 125 °C
25 °C
-40 °C
85 °C
Ct - VR
0
50
100
150
200
250
300
350
400
450
0 5 10 15 20 25 30 35 40
Reverse voltage VR (V)
Terminal capacitance Ct (pF)
Ta = 25 °C
f = 1 MHz
Rth
- t
1
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Time t (s)
Thermal resistance Rth (°C/W)
(1)
Rth(j-l) = 9 °C/W
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
(3) Mounted on alumina print board.
Board size : 50 mm × 50 mm x 0.8 mm
Solder in : 2 mm x 2 mm
(2)
(3)
IF(AV) - Tl
0
0.5
1
1.5
2
2.5
3
3.5
0 25 50 75 100 125 150 175
Lead temperature Tl (°C)
Forward current (Average) IF(AV) (A)
DC
1/4
tp/T
1/2
Sine Wave
VR = 30 V
Tj = 125 °C
tp
IF
PF(AV) - IF(AV)
0
0.5
1
1.5
2
0 0.5 1 1.5 2 2.5 3 3.5
Forward current (Average) IF(AV) (A)
Forward power dissipation (Average) PF(AV) (W)
DC
1/4
1/2
Sine Wave
tp
IF