2004 Feb 11 3
NXP Semiconductors Product specification
General purpose PIN diode BAP51-03
ELECTRICAL CHARACTERISTICS
T
j
=25C unless otherwise specified.
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
forward voltage I
F
=50mA 0.95 1.1 V
V
R
reverse voltage I
R
=10A50V
I
R
reverse current V
R
=50V 100 nA
C
d
diode capacitance V
R
=0; f=1MHz 0.4 pF
V
R
=1V; f=1MHz 0.3 0.55 pF
V
R
=5V; f=1MHz 0.2 0.35 pF
r
D
diode forward resistance I
F
= 0.5 mA; f = 100 MHz; note 1 5.5 9
I
F
= 1 mA; f = 100 MHz; note 1 3.6 6.5
I
F
= 10 mA; f = 100 MHz; note 1 1.5 2.5
L
charge carrier life time when switched from I
F
=10mA to
I
R
=6mA; R
L
=100; measured
at I
R
=3mA
550 ns
SYMBOL PARAMETER VALUE UNIT
R
th(j-s)
thermal resistance from junction to soldering point 120 K/W
