MILITARY & SPACE
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
MILITARY & SPACE PRODUCTS
Table 1: Class B Packaged MMIC Die and MIC Sub-Assembly Screening Procedure to
MIL-PRF-38534 and MIL-PRF-38535 as applicable.
Screen MIL-STD-883 Test Method and Condition
1. Electrostatic Discharge Sensitivity (ESD) 3015
2. Wafer Acceptance Table 2 herein. Class-B element evaluation
3. Internal visual 2010, Test Condition B
4. Temperature cycling 1010, Test Condition C, 10 cycles minimum
5. Constant acceleration 2001, Test Condition A, Y1 orientation only
6. Serialization In accordance with device speci cation
7. Interim (pre burn-in) electrical parameters In accordance with device speci cation
8. Burn-in test 1015, 160 hours at +125 °C, biased
9. Interim (post burn-in) electrical parameters In accordance with device speci cation
10. Final electrical test In accordance with device speci cation
11. Seal
a. Fine
b. Gross
1014, Test Condition A & C
12. External visual 2009 and product outline speci cation
Military Level (Class B) MMIC Die and Packaged Die Screening
Hittite Microwave performs Class B screening on standard
& custom product die and packaged die including SMT
plastic encapsulated devices for COTS applications. We
also design, produce and screen highly integrated MIC
modules and subsystems for major defense OEMs.
Die are shipped at customer request in either conductive
standard Gel-Paks or conductive standard Waf e-Paks.
Tables 1 & 2 summarize tests Hittite Microwave will
perform on die, packaged die, modules and subsystems
for military and Hi-Rel commercial applications.
Military Screened Sub-Assembly
Containing MIC Modules
v02.0106
COTS SMT
Plastic Package
Class B Die MIC Hybrids
COTS SMT
Hermetic Package
Hermetic
Connectorized
Module
