NCP59150, NCV59150 Series
http://onsemi.com
14
PACKAGE DIMENSIONS
DFN8, 4x4
CASE 488AF
ISSUE C
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. DETAILS A AND B SHOW OPTIONAL
CONSTRUCTIONS FOR TERMINALS.
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
D 4.00 BSC
D2 1.91 2.21
E 4.00 BSC
E2 2.09 2.39
e 0.80 BSC
K 0.20 −−−
L 0.30 0.50
D
B
E
C0.15
A
C0.15
2X
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
C
A
(A3)
A1
8X
SEATING
PLANE
C0.08
C0.10
e
8X
L
K
E2
D2
b
NOTE 3
1
4
58
8X
0.10 C
0.05 C
AB
PIN ONE
REFERENCE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8X
0.63
2.21
2.39
8X
0.80
PITCH
4.30
0.35
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
L1 −−− 0.15
DETAIL B
NOTE 4
DETAIL A
DIMENSIONS: MILLIMETERS
PACKAGE
OUTLINE
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