www.austriamicrosystems.com Revision 1.78 12 - 15
AS1741
Data Sheet - Package Drawings and Markings
10 Package Drawings and Markings
The devices are available in an 8-pin MSOP package and an 8-pin SOT23 package.
Figure 18. 8-pin MSOP Package
Notes:
1. All dimensions are in millimeters, angles in degrees, unless otherwise specified.
2. Datums B and C to be determined at datum plane H.
3. Dimensions D and E1 are to be determined at datum plane H.
4. Dimensions D2 and E2 are for top package; dimensions D and E1 are for bottom package.
5. Cross section A-A to be determined at 0.13 to 0.25mm from lead tip.
6. Dimensions D and D2 do not include mold flash, protrusion, or gate burrs.
7. Dimensions E1 and E2 do not include interlead flash or protrusion.
Symbol Typ ±Tol Symbol Typ ±Tol
A 1.10 Max b 0.33 +0.07/-0.08
A1 0.10 ±0.05 b1 0.30 ±0.05
A2 0.86 ±0.08 c 0.18 ±0.05
D 3.00 ±0.10 c1 0.15 +0.03/-0.02
D2 2.95 ±0.10
θ1 3.0º ±3.0º
E 4.90 ±0.15
θ2 12.0º ±3º
E1 3.00 ±0.10
θ3 12.0º ±3º
E2 2.95 ±0.10 L 0.55 ±0.15
E3 0.51 ±0.13 L1 0.95BSC -
E4 0.51 ±0.13 aaa 0.10 -
R 0.15 +0.15/-0.08 bbb 0.08 -
R1 0.15 +0.15/-0.08 ccc 0.25 -
t1 0.31 ±0.08 e 0.65 BSC -
t2 0.41 ±0.08 S 0.525 BSC -
