PROTECTION PRODUCTS
1
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS - RailClamp
®®
®®
®
RClamp3328P
Low Capacitance RClamp
®
8-Line ESD Protection
Description
Features
Dimensions Circuit Diagram
Revision 7/18/2013
Applications
Mechanical Characteristics
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20s)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
Flow-Through design
Protects eight high-speed lines
Low capacitance: 0.65pF Maximum (I/O to Ground)
Low ESD clamping voltage
Low dynamic resistance: 0.35 Ohms (Typ)
Solid-state silicon-avalanche technology
SGP3810N9 9-pin package (3.8 x 1.0 x 0.50mm)
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead Pitch: 0.4mm (intra-pair), 0.50mm (pair-to-
pair)
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel
8-Line ProtectionNominal Dimensions in mm (Bottom View)
124 5
3
6789
The RClamp
®
3328P provides low voltage ESD protec-
tion for high-speed ports. It features a high maximum
ESD withstand voltage of ±25kV contact and ±30kV
air discharge per IEC 61000-4-2. RClamp3328P is
designed to minimize both the ESD peak clamping and
the TLP clamping. Peak ESD clamping voltage is
extremely low and approximately the same at each pin.
The dynamic resistance is among the industry’s lowest
at 0.35 Ohms (typical). Maximum capacitance on each
line to ground is 0.65pF. This allows the
RClamp3328P to be used in applications operating in
excess of 5GHz without signal attenuation. These
devices are manufactured using Semtech’s proprietary
low voltage EPD technology for superior characteritics
at operating voltages up to 3.3 volts. Each device will
protect up to eight lines (four high-speed pairs).
The RClamp3328P is in a 9-pin SGP3810N9 package. It
measures 3.8 x 1.0mm with a nominal height of 0.50mm.
Intra-pair lead pitch is 0.40mm while the pair-to-pair pitch
is 0.5mm. The innovative flow through package design
simplifies pcb layout and allows matched trace lengths
for consistant impedance between high speed differen-
tial lines.
The combination of low peak ESD clamping, low dynamic
resistance, and innovative package design enables this
device provides the highest level of ESD protection for
applications such as USB 3.0, HDMI and V-By-One inter-
faces.
HDMI 1.3/1.4
V-By-One
USB 3.0
eDP
MHL
LVDS Interfaces
eSATA Interfaces
0.50
1.00
0.50 BSC
0.40 BSC
3.80
