Package Dimensions
Figure 4: 170-Ball FBGA (BG)
0.12
Seating plane
0.1 A
Ball A1 ID
(covered by SR)
Ball A1 ID
0.35 ±0.05
1.1 ±0.1
10.4 CTR
12 ±0.1
0.8 TYP
12.8 CTR
14 ±0.1
170X Ø0.47
Dimensions apply
to solder balls post-
reflow on Ø0.40 SMD
ball pads.
0.8 TYP
123101112
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
451314
A
0.6 CTR
nonconductive
overmold
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC-Q (92.5% Sn, 4% Ag, 3% Bi, 0.5% Cu).
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Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
8Gb: x16, x32 GDDR5 SGRAM
Package Dimensions
09005aef86281891
8Gb_gddr5_sgram_brief.pdf - Rev. F 2/17 EN
7
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© 2015 Micron Technology, Inc. All rights reserved.
