PC817XJ0000F
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC817)
2. Package resin : UL flammability grade
(94V-0)
Features
Agency approvals/Compliance
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
Applications
DIP 4pin General Purpose
Photocoupler
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. High collector-emitter voltage (V
CEO
:80V)
4. Current transfer ratio (CTR : MIN. 50% at I
F
=5 mA,
V
CE
=5V)
5. Several CTR ranks available
6. High isolation voltage between input and output
(V
iso(rms)
: 5.0 kV)
7. Lead-free and RoHS directive compliant
4-channel package type is also available.
(model No. PC847XJ0000F Series)
Description
PC817XJ0000F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 50% to
600% at input current of 5mA.
1
Sheet No.: D2-A03102EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC817XJ0000F Series
Internal Connection Diagram
Anode
Cathode
Emitter
Collector
1
1
2
3
4
2
4
3
2
Sheet No.: D2-A03102EN
Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC817XJ0000F] 2. SMT Gullwing Lead-Form [ex. PC817XIJ000F]
3.
Wide Through-Hole Lead-Form
[ex. PC817XFJ000F]
Product mass : approx. 0.22gProduct mass : approx. 0.23g
Product mass : approx. 0.22gProduct mass : approx. 0.23g
4.
Wide SMT Gullwing Lead-Form
[ex. PC817XFPJ00F]
6.5
±0.5
7.62
±0.3
4.58
±0.5
θ
θ
θ : 0 to 13˚
Epoxy resin
3.5
±0.5
3.0
±0.5
0.5
TYP.
0.6
±0.2
1.2
±0.3
1
2
4.58
±0.5
2.54
±0.25
4
3
Anode mark
Rank mark
Factory identification mark
Date code
PC817
2.7
±0.5
0.5
±0.1
0.26
±0.1
0.6
±0.2
1.2
±0.3
6.5
±0.5
7.62
±0.3
0.26
±0.1
4.58
±0.5
2.54
±0.25
Epoxy resin
3.5
±0.5
4.58
±0.5
2.54
±0.25
4
3
Anode mark
Rank mark
Factory identification mark
Date code
1.0
+0.4
0
1.0
+0.4
0
10.0
+0
0.5
0.35
±0.25
1
2
PC817
PC817
4.58
±0.5
0.6
±0.2
1.2
±0.3
1.0
±0.1
2.54
±0.25
6.5
±0.5
Anode mark
Factory identification mark
Date code
4
3
7.62
±0.3
10.16
±0.5
0.26
±0.1
4.58
±0.5
0.5
±0.1
Epoxy resin
3.5
±0.5
2.7
MIN.
Rank mark
1
2
PC817
0.6
±0.2
1.2
±0.3
1.0
±0.1
6.5
±0.5
10.16
±0.5
0.75
±0.25
0.75
±0.25
4.58
±0.5
2.54
±0.25
Anode mark
Rank mark
Factory identification mark
Date code
4
3
7.62
±0.3
12.0
MAX
4.58
±0.5
Epoxy resin
3.5
±0.5
0.26
±0.1
0.5
±0.1
0.25
±0.25
1
2
PC817XJ0000F Series
Date code (2 digit)
Rank mark
Refer to the Model Line-up table
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
·
·
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark and Plating material
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
China
Plating material
SnCu (Cu : TYP. 2%)
SnBi (Bi : TYP. 2%)
SnCu (Cu : TYP. 2%)*
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%).
** This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
3
repeats in a 20 year cycle
Sheet No.: D2-A03102EN
PC817XJ0000F Series

PC817X4J000F

Mfr. #:
Manufacturer:
Sharp Microelectronics
Description:
OPTOISOLATOR 5KV TRANS 4DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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