BYC8-600P,127

NXP Semiconductors
BYC8-600P
Hyperfast power diode
BYC8-600P All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 3 January 2014 3 / 9
Symbol Parameter Conditions Min Max Unit
t
p
= 10 ms; T
j(init)
= 25 °C; sine-wave
pulse; Fig. 4
- 91 AI
FSM
non-repetitive peak forward
current
t
p
= 8.3 ms; T
j(init)
= 25 °C; sine-wave
pulse; Fig. 4
- 100 A
T
stg
storage temperature -65 175 °C
T
j
junction temperature - 175 °C
003aaj898
I
F(AV)
(A)
0 1284
8
16
24
P
tot
(W)
0
δ
= 1
0.5
0.2
0.1
Fig. 1. Forward power dissipation as a function of
average forward current; square waveform;
maximum values
I
F(AV)
(A)
0 862 4
003aaj899
8
12
4
16
20
P
tot
(W)
0
a = 1.57
1.9
2.2
2.8
4.0
Fig. 2. Forward power dissipation as a function of
average forward current; sinusoidal waveform;
maximum values
T
mb
(°C)
-50 20015050 1000
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4
8
12
I
F(AV)
(A)
0
130 °C
Fig. 3. Average forward current as a function of
mounting base temperature; maximum values
t
p
(s)
10
-5
10
-2
10
-3
10
-4
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10
3
10
2
10
4
I
FSM
(A)
10
t
p
P
t
Fig. 4. Non-repetitive peak forward current as a
function of pulse width; square waveform;
maximum values
NXP Semiconductors
BYC8-600P
Hyperfast power diode
BYC8-600P All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 3 January 2014 4 / 9
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance
from junction to
mounting base
Fig. 5 - - 2.5 K/W
R
th(j-a)
thermal resistance
from junction to
ambient free air
in free air - 60 - K/W
001aag913
1
10
- 1
10
Z
th(j-mb)
(K/W)
10
- 3
10
- 2
t
p
(s)
10
- 6
10110
- 1
10
- 5
10
- 3
10
- 2
10
- 4
t
p
t
p
T
P
t
T
δ =
Fig. 5. Transient thermal impedance from junction to mounting base as a function of pulse width
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
I
F
= 8 A; T
j
= 25 °C; Fig. 6 - - 3.4 V
I
F
= 8 A; T
j
= 125 °C; Fig. 6 - 1.5 1.9 V
V
F
forward voltage
I
F
= 8 A; T
j
= 150 °C - 1.4 - V
V
R
= 600 V; T
j
= 25 °C - - 20 µAI
R
reverse current
V
R
= 600 V; T
j
= 125 °C - - 200 µA
Dynamic characteristics
I
F
= 8 A; V
R
= 200 V; dI
F
/dt = 200 A/µs;
T
j
= 25 °C; Fig. 7
- 17 - nCQ
r
recovered charge
I
F
= 8 A; V
R
= 200 V; dI
F
/dt = 200 A/µs;
T
j
= 125 °C; Fig. 7
- 90 - nC
t
rr
reverse recovery time I
F
= 8 A; V
R
= 400 V; dI
F
/dt = 500 A/µs;
T
j
= 25 °C; Fig. 7
- 19 - ns
NXP Semiconductors
BYC8-600P
Hyperfast power diode
BYC8-600P All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 3 January 2014 5 / 9
Symbol Parameter Conditions Min Typ Max Unit
I
F
= 1 A; V
R
= 30 V; dI
F
/dt = 200 A/µs;
T
j
= 25 °C; Fig. 7
- 12 18 ns
I
F
= 8 A; V
R
= 200 V; dI
F
/dt = 200 A/µs;
T
j
= 25 °C; Fig. 7
- - 2.2 AI
RM
peak reverse recovery
current
I
F
= 8 A; V
R
= 200 V; dI
F
/dt = 200 A/µs;
T
j
= 125 °C; Fig. 7
- - 6 A
V
F
(V)
0 431 2
003aaj903
8
4
12
16
I
F
(A)
0
(1) (2) (3)
Fig. 6. Forward current as a function of forward
voltage
Fig. 7. Reverse recovery definitions; ramp recovery

BYC8-600P,127

Mfr. #:
Manufacturer:
WeEn Semiconductors
Description:
Rectifiers Hyperfast power Diode
Lifecycle:
New from this manufacturer.
Delivery:
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