10
FN9196.1
February 19, 2014
to the selected feedback voltage and amplifies the
difference. The MOSFET driver reads the error signal and
applies the appropriate drive to the P-Channel pass
transistor. If the feedback voltage is lower than the reference
voltage, the pass transistor gate is pulled lower, allowing
more current to pass and increasing the output voltage. If the
feedback voltage is higher than the reference voltage, the
pass transistor gate is driven higher, allowing less current to
pass to the output.
Internal P-Channel Pass Transistors
Both the LDO Regulators in ISL6455 feature a typical 0.5
r
DS(on)
P-channel MOSFET pass transistor. This provides
several advantages over similar designs using PNP bipolar
pass transistors. The P-Channel MOSFET requires no base
drive, which reduces quiescent current considerably. PNP
based regulators waste considerable current in dropout
when the pass transistor saturates. They also use high base
drive currents under large loads. The ISL6455 does not have
these drawbacks.
Integrated RESET for MAC/Baseband Processors
The ISL6455 includes a microprocessor supervisory block.
This block eliminates an extra RESET IC and external
components needed in wireless chipset applications. This
block performs a single function; it asserts a RESET
signal
whenever the VIN_PWM supply voltage decreases below a
preset threshold, and keeps it asserted for a programmable
time period set by the external capacitor CT.
UVLO Reset threshold is always lower than the RESET
threshold. This insures that as V
IN
falls, the reset goes low
before the LDOs and PWM are shut off.
Integrator Circuitry
Both ISL6455 LDO Regulators use external 33nF
compensation capacitors for minimizing load and line
regulation errors and for lowering output noise. When the
output voltage shifts due to varying load current or input
voltage, the integrator capacitor voltage is raised or lowered
to compensate for the systematic offset at the error amplifier.
Compensation is limited to ±5% to minimize transient
overshoot when the device goes out of dropout, current limit,
or thermal shutdown.
Shutdown
Driving the EN_LDO pin low will put LDO1 and LDO2 into
the shutdown mode. Driving the EN pin low will put the PWM
into shutdown mode. Pulling both the EN and EN_LDO pins
low simultaneously, puts the ISL6455, ISL6455A in a
shutdown mode, and supply current drops to 15µA typical.
Protection Features for the LDOs
Current Limit
The ISL6455 and ISL6455A monitor and control the pass
transistor’s gate voltage to limit the output current. The
current limit for both LDO1 and LDO2 is 330mA. The output
can be shorted to ground without damaging the part due to
the current limit and thermal protection features.
Thermal Overload Protection
Thermal overload protection limits total power dissipation in
the ISL6455, ISL6455A. When the junction temperature (T
J
)
exceeds +150°C, the thermal sensor sends a signal to the
shutdown logic, turning off the pass transistor and allowing
the IC to cool. The pass transistor turns on again after the
IC’s junction temperature typically cools by +20°C, resulting
in an intermittent output condition during continuous thermal
overload. Thermal overload protection protects the ISL6455,
ISL6455A against fault conditions. For continuous operation,
the absolute maximum junction temperature rating of
+150°C in not to be exceeded.
Operating Region and Power Dissipation
The maximum power dissipation of ISL6455 depends on the
thermal resistance of the IC package and circuit board, the
temperature difference between the die junction and ambient
air, and the rate of air flow. The power dissipated in the
device is:
PT = P1 + P2 + P3, where:
P1 = I
OUT1
x V
OUT1
x n, n is the efficiency of the PWM
P2 = I
OUT2
(V
IN
– V
OUT2
)
P3 = I
OUT3
(V
IN
- V
OUT3
)
The maximum power dissipation is:
P
max
= (T
jmax
– T
A
)/
JA
Where T
jmax
= +150°C, T
A
= ambient temperature, and
JA
is the thermal resistance from the junction to the surrounding
environment.
The ISL6455, ISL6455A package feature an exposed
thermal pad on its underside. This pad lowers the thermal
resistance of the package by providing a direct heat
conduction path from the die to the PC board. Additionally,
the ISL6455 and ISL6455A ground (GND_LDO and PGND)
performs the dual function of providing an electrical
connection to system ground and channeling heat away.
Connect the exposed bottom pad direct to the GND_LDO
ground plane.
Application Information
LDO Regulator Capacitor Selection and Regulator
Stability
Capacitors are required at the ISL6455, ISL6455A LDO
regulators’ input and output for stable operation over the
entire load range and the full temperature range. Use >1µF
capacitor at the input of LDO regulators, V
IN
_LDO pins. The
input capacitor lowers the source impedance of the input
supply. Larger capacitor values and lower ESR provide
better PSRR and line transient response. The input
ISL6455, ISL6455A
capacitor must be located at a distance of not more than 0.5
inches from the V
IN
pins of the IC and returned to a clean
analog ground. Any good quality ceramic capacitor can be
used as an input capacitor.
The output capacitor must meet the requirements of
minimum amount of capacitance and ESR for both LDOs.
The ISL6455 is specifically designed to work with small
ceramic output capacitors. The output capacitor’s ESR
affects stability and output noise. Use an output capacitor
with an ESR of 50m or less to insure stability and optimum
transient response. For stable operation, a ceramic
capacitor, with a minimum value of 3.3µF, is recommended
for V
OUT1
for 300mA output current, and 3.3µF is
recommended for V
OUT2
at 300mA load current. There is no
upper limit to the output capacitor value. A larger capacitor
can reduce noise and improve load transient response,
stability and PSRR. A higher value output capacitor (10µF) is
recommended for LDO2 when used to power VCO circuitry
in wireless chipsets. The output capacitor should be located
very close to V
OUT
pins to minimize impact of PC board
inductances and the other end of the capacitor should be
returned to a clean analog ground.
PWM Regulator Component Selection
INDUCTOR SELECTION
A 8.2µH typical output inductor is used with the ISL6455 and
a 12µH typical with the ISL6455A PWM section. Values less
than this may cause stability problems because of the
internal compensation of the regulator. The important
parameters of the inductor that need to be considered are
the current rating of the inductor and the DC resistance of
the inductor. The DC resistance of the inductor will influence
directly the efficiency of the converter. Therefore, an inductor
with lowest DC resistance should be selected for highest
efficiency. In order to avoid saturation of the inductor, the
inductor should be rated at least for the maximum output
current plus the inductor ripple current. (See Table 1).
OUTPUT CAPACITOR SELECTION
For the best performance, a low ESR output capacitor is
needed. If an output capacitor is selected with an ESR value
120m, its RMS ripple current rating will always meet the
application requirements. The RMS ripple current is
calculated as shown in Equation 1:
The overall output ripple voltage is the sum of the voltage
spike caused by the output capacitor ESR plus the voltage
ripple caused by charge and discharging the output
capacitor as shown in Equation 2:
Where the highest output voltage ripple occurs at the highest
input voltage.
INPUT CAPACITOR SELECTION
Because of the nature of the buck converter having a
pulsating input current, a low ESR input capacitor is required
for best input voltage filtering and minimizing the
interference with other circuits caused by high input voltage
spikes.
The input capacitor should have a minimum value of 10µF
and can be increased without any limit for better input
voltage filtering. The input capacitor should be rated for the
maximum input ripple current calculated as shown in
Equation 3:
The worst case RMS ripple current occurs at D = 0.5.
Ceramic capacitors show good performance because of
their low ESR value, and because they are less sensitive to
voltage transients, compared to tantalum capacitors.
Place the input capacitor as close as possible to the input pin
of the IC for best performance.
TABLE 1. RECOMMENDED INDUCTORS
OUTPUT
CURRENT
INDUCTOR
VALUE
VENDOR PART
NUMBER COMMENTS
600mA 8.2µH Coilcraft
MSS6122-822MX
ISL6455
600mA 12µH Coilcraft
MSS6122-123MX
ISL6455A
TABLE 2. RECOMMENDED CAPACITORS
CAPACITOR
VALUE ESR/m
VENDOR PART
NUMBER COMMENTS
10µF <50 TDK
C2012X5R0J106M
Ceramic
I
RMS C
O
V
O
1
V
O
V
I
--------
Lf
-----------------
1
23
-----------------
=
(EQ. 1)
V
O
V
O
1
V
O
V
I
--------
Lf
-----------------






1
8C
O
f
--------------------------
ESR+


=
(EQ. 2)
I
RMS
I
Omax
V
O
V
I
--------
1
V
O
V
I
--------



=
(EQ. 3)
ISL6455, ISL6455A
12
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FN9196.1
February 19, 2014
Output Voltage Setting
The equations for the Output voltages are shown in Equation
4:
The output resistors should be selected so that the minimum
output load is about 200
µA.
Layout Considerations
As for all switching power supplies, the layout is an important
step in the design of ISL6455, ISL6455A based power
supply due to the high switching frequency and low noise
LDO implementations.
Allocate two board levels as ground planes, with many vias
between them to create a low impedance, high-frequency
plane. Tie all the device ground pins through multiple vias
each to this ground plane, as close to the device as possible.
Also tie the exposed pad on the bottom of the device to this
ground plane.
Use wide and short traces for the high current paths. The
input capacitor should be placed as close as possible to the
IC pins as well as the inductor and output capacitor. Use a
common ground node to minimize the effects of ground
noise.
VOUT
0.45
Rf
-----------
Re Rf+=
VOUT1
1.184
Rb
---------------
Ra Rb+=
VOUT2
1.184
Rd
---------------
Rc Rd+=
(EQ. 4)
ISL6455, ISL6455A

ISL6455AIRZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers SYNC BUCK PWMG DLLDO 5V INP 24LD 4X4
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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