DS1210
4 of 8
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground -0.3V to +7.0V
Operating Temperature Range 0°C to +70°C, -40°C to +85°C for N parts
Storage Temperature Range -55°C to +125°C
Soldering Temperature (reflow, SO) +260°C
Lead Temperature (soldering, 10s) +300°C
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of
time may affect reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PDIP
Junction-to-Ambient Thermal Resistance (θ
JA
).…………………...…………………………...….110°C/W
Junction-to-Case Thermal Resistance (θ
JC
)…………………………………………………………40°C/W
SO
Junction-to-Ambient Thermal Resistance (θ
JA
).…………………………………………………….70°C/W
Junction-to-Case Thermal Resistance (θ
JC
)…………………………………………………………23°C/W
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board for the SO.
For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
RECOMMENDED OPERATING CONDITIONS (Note 10)
4B
0B
TOL = V
CCO
Supply Voltage
BAT1
DC ELECTRICAL CHARACTERISTICS
(Note 10; V
CCI
= 4.75 to 5.5V, TOL = GND)
(V
CCI
= 4.5 to 5.5V, TOL = V
CCO
)
1B
OH
OL
V
CC
Trip Point (TOL=GND)
V
CC
Trip Point (TOL=V
CCO
)
OHL
BAT
BAT1
BAT2
I
BAT
100 nA 3, 4
Battery Backup Current
@ V
CCO
= V
BAT
– 0.3V
I
CCO2
50 µA 7, 8