MAX1182
Dual 10-Bit, 65Msps, 3V, Low-Power ADC
with Internal Reference and Parallel Outputs
______________________________________________________________________________________ 13
Analog Inputs and Reference
Configurations
The full-scale range of the MAX1182 is determined by the
internally generated voltage difference between REFP
(V
DD
/ 2 + V
REFIN
/ 4) and REFN (V
DD
/ 2 - V
REFIN
/ 4).
The full-scale range for both on-chip ADCs is adjustable
through the REFIN pin, which is provided for this purpose.
REFOUT, REFP, COM (V
DD
/ 2), and REFN are internal-
ly buffered low-impedance outputs.
The MAX1182 provides three modes of reference oper-
ation:
• Internal reference mode
• Buffered external reference mode
• Unbuffered external reference mode
In internal reference mode, connect the internal refer-
ence output REFOUT to REFIN through a resistor (e.g.,
10kΩ) or resistor divider, if an application requires a
reduced full-scale range. For stability and noise filtering
purposes bypass REFIN with a > 10nF capacitor to
GND. In internal reference mode, REFOUT, COM,
REFP, and REFN become low-impedance outputs.
In buffered external reference mode, adjust the refer-
ence voltage levels externally by applying a stable and
accurate voltage at REFIN. In this mode, COM, REFP,
and REFN become outputs. REFOUT may be left open
or connected to REFIN through a > 10kΩ resistor.
In unbuffered external reference mode, connect REFIN
to GND. This deactivates the on-chip reference buffers
for REFP, COM, and REFN. With their buffers shut
down, these nodes become high impedance and may
be driven through separate external reference sources.
Clock Input (CLK)
The MAX1182’s CLK input accepts CMOS-compatible
clock signals. Since the interstage conversion of the
device depends on the repeatability of the rising and
falling edges of the external clock, use a clock with low
jitter and fast rise and fall times (< 2ns). In particular,
sampling occurs on the rising edge of the clock signal,
requiring this edge to provide lowest possible jitter. Any
significant aperture jitter would limit the SNR perfor-
mance of the on-chip ADCs as follows:
SNR
dB
= 20
log
10
(1 / [2π x f
IN
x t
AJ
]),
where f
IN
represents the analog input frequency and t
AJ
is the time of the aperture jitter.
Clock jitter is especially critical for undersampling
applications. The clock input should always be consid-
ered as an analog input and routed away from any ana-
log input or other digital signal lines.
The MAX1182 clock input operates with a voltage thresh-
old set to V
DD
/ 2. Clock inputs with a duty cycle other
than 50%, must meet the specifications for high and low
periods as stated in the Electrical Characteristics.
System Timing Requirements
Figure 3 depicts the relationship between the clock
input, analog input, and data output. The MAX1182
samples at the rising edge of the input clock. Output
data for channels A and B is valid on the next rising
edge of the input clock. The output data has an internal
latency of five clock cycles. Figure 4 also determines
the relationship between the input clock parameters
and the valid output data on channels A and B.
Digital Output Data, Output Data Format
Selection (T/B), Output Enable (/OE)
All digital outputs, D0A–D9A (Channel A) and D0B–D9B
(Channel B), are TTL/CMOS logic-compatible. There is
a 5-clock-cycle latency between any particular sample
and its corresponding output data. The output coding
can be chosen to be either straight offset binary or
two’s complement (Table 1) controlled by a single pin
(T/B). Pull T/B low to select offset binary and high to
activate two’s complement output coding. The capaci-
tive load on the digital outputs D0A–D9A and D0B–D9B
should be kept as low as possible (< 15pF), to avoid
large digital currents that could feed back into the ana-
log portion of the MAX1182, thereby degrading its
dynamic performance. Using buffers on the digital out-
puts of the ADCs can further isolate the digital outputs
from heavy capacitive loads. To further improve the
dynamic performance of the MAX1182 small-series
resistors (e.g., 100Ω) maybe added to the digital output
paths, close to the MAX1182.
Figure 4 displays the timing relationship between out-
put enable and data output valid as well as power
down/wake-up and data output valid.
Power-Down (PD) and
Sleep (SLEEP) Modes
The MAX1182 offers two power-save modes—sleep and
full power-down mode. In sleep mode (SLEEP = 1), only
the reference bias circuit is active (both ADCs are dis-
abled), and current consumption is reduced to 2.8mA.
To enter full power-down mode, pull PD high. With OE
simultaneously low, all outputs are latched at the last
value prior to the power down. Pulling OE high forces
the digital outputs into a high impedance state.
MAX1182
Dual 10-Bit, 65Msps, 3V, Low-Power ADC
with Internal Reference and Parallel Outputs
14 ______________________________________________________________________________________
Applications Information
Figure 5 depicts a typical application circuit containing
two single-ended to differential converters. The internal
reference provides a V
DD
/ 2 output voltage for level
shifting purposes. The input is buffered and then split to
a voltage follower and inverter. One lowpass filter per
ADC suppresses some of the wideband noise associat-
ed with high-speed operational amplifiers, follows the
amplifiers. The user may select the R
ISO
and C
IN
val-
ues to optimize the filter performance, to suit a particu-
lar application. For the application in Figure 5, a R
ISO
of
50Ω is placed before the capacitive load to prevent
ringing and oscillation. The 22pF C
IN
capacitor acts as
a small bypassing capacitor.
Using Transformer Coupling
A RF transformer (Figure 6) provides an excellent solu-
tion to convert a single-ended source signal to a fully
differential signal, required by the MAX1182 for opti-
mum performance. Connecting the center tap of the
transformer to COM provides a V
DD
/ 2 DC level shift to
the input. Although a 1:1 transformer is shown, a step-
up transformer may be selected to reduce the drive
requirements. A reduced signal swing from the input
driver, such as an op amp, may also improve the over-
all distortion.
In general, the MAX1182 provides better SFDR and
THD with fully-differential input signals than single-
ended drive, especially for very high input frequencies.
In differential input mode, even-order harmonics are
lower as both inputs (INA+, INA- and/or INB+, INB-) are
balanced, and each of the ADC inputs only requires
half the signal swing compared to single-ended mode.
N - 6
N
N - 5
N + 1
N - 4
N + 2
N - 3
N + 3
N - 2
N + 4
N - 1
N + 5
N
N + 6
N + 1
5 CLOCK-CYCLE LATENCY
ANALOG INPUT
CLOCK INPUT
DATA OUTPUT
D9A–D0A
t
D0
t
CH
t
CL
N - 6 N - 5 N - 4 N - 3 N - 2 N - 1 N N + 1
DATA OUTPUT
D9B–D0B
OUTPUT
D9A–D0A
OE
t
DISABLE
t
ENABLE
HIGH IMPEDANCE
HIGH IMPEDANCE
HIGH IMPEDANCE
HIGH IMPEDANCE
VALID DATA
OUTPUT
D9B–D0B
VALID DATA
Figure 3. System Timing Diagram
Figure 4. Output Timing Diagram
MAX1182
Dual 10-Bit, 65Msps, 3V, Low-Power ADC
with Internal Reference and Parallel Outputs
______________________________________________________________________________________ 15
Table 1. MAX1182 Output Codes For Differential Inputs
*V
REF
= V
REFP
- V
REFN
DIFFERENTIAL INPUT
VOLTAGE*
DIFFERENTIAL
INPUT
STRAIGHT OFFSET
BINARY
T/B = 0
TWO’S COMPLEMENT
T/B = 1
V
REF
x 511/512 +FULL SCALE - 1 LSB 11 1111 1111 01 1111 1111
V
REF
x 1/512 +1 LSB 10 0000 0001 00 0000 0001
0 Bipolar Zero 10 0000 0000 00 0000 0000
-V
REF
x 1/512 -1 LSB 01 1111 1111 11 1111 1111
-V
REF
x 511/512 -FULL SCALE + 1 LSB 00 0000 0001 10 0000 0001
-V
REF
x 512/512 -FULL SCALE 00 0000 0000 10 0000 0000
Single-Ended AC-Coupled Input Signal
Figure 7 shows an AC-coupled, single-ended applica-
tion. Amplifiers like the MAX4108 provide high-speed,
high-bandwidth, low noise, and low distortion to main-
tain the integrity of the input signal.
Typical QAM Demodulation Application
The most frequently used modulation technique for digi-
tal communications applications is probably the
Quadrature Amplitude Modulation (QAM). Typically
found in spread-spectrum based systems, a QAM signal
represents a carrier frequency modulated in both ampli-
tude and phase. At the transmitter, modulating the base-
band signal with quadrature outputs, a local oscillator
followed by subsequent up-conversion can generate the
QAM signal. The result is an in-phase (I) and a quadra-
ture (Q) carrier component, where the Q component is
90 degree phase-shifted with respect to the in-phase
component. At the receiver, the QAM signal is divided
down into it’s I and Q components, essentially repre-
senting the modulation process reversed. Figure 8 dis-
plays the demodulation process performed in the
analog domain, using the dual matched 3V, 10-bit ADC
MAX1182 and the MAX2451 quadrature demodulator to
recover and digitize the I and Q baseband signals.
Before being digitized by the MAX1182, the mixed-down
signal components may be filtered by matched analog
filters, such as Nyquist or pulse-shaping filters which
remove any unwanted images from the mixing process,
thereby enhancing the overall signal-to-noise (SNR) per-
formance and minimizing inter-symbol interference.
Grounding, Bypassing, and
Board Layout
The MAX1182 requires high-speed board layout design
techniques. Locate all bypass capacitors as close to
the device as possible, preferably on the same side as
the ADC, using surface-mount devices for minimum
inductance. Bypass V
DD
, REFP, REFN, and COM with
two parallel 0.1µF ceramic capacitors and a 2.2µF
bipolar capacitor to GND. Follow the same rules to
bypass the digital supply (OV
DD
) to OGND. Multilayer
boards with separated ground and power planes pro-
duce the highest level of signal integrity. Consider the
use of a split ground plane arranged to match the
physical location of the analog ground (GND) and the
digital output driver ground (OGND) on the ADCs pack-
age. The two ground planes should be joined at a sin-
gle point such that the noisy digital ground currents do
not interfere with the analog ground plane. The ideal
location of this connection can be determined experi-
mentally at a point along the gap between the two
ground planes, which produces optimum results. Make
this connection with a low-value, surface-mount resistor
(1Ω to 5Ω), a ferrite bead or a direct short. Alternatively,
all ground pins could share the same ground plane, if
the ground plane is sufficiently isolated from any noisy,
digital systems ground plane (e.g., downstream output
buffer or DSP ground plane). Route high-speed digital
signal traces away from the sensitive analog traces of
either channel. Make sure to isolate the analog input
lines to each respective converter to minimize channel-
to-channel crosstalk. Keep all signal lines short and
free of 90 degree turns.

MAX1182ECM+TD

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Analog to Digital Converters - ADC 10-Bit 2Ch 65Msps High Speed ADC
Lifecycle:
New from this manufacturer.
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