Applications Information
MOSFET Configuration
The MAX4843–MAX4846 can be used with either a sin-
gle MOSFET configuration as shown in the
Typical
Operating Circuit
, or can be configured with a back-to-
back MOSFET as shown in Figure 5. The back-to-back
configuration has almost zero reverse current when the
input supply is below the output.
If reverse current leakage is not a concern, a single
MOSFET can be used. This approach has half the loss of
the back-to-back configuration when used with similar
MOSFET types and is a lower cost solution. Note that if
the input is actually pulled low, the output is also pulled
low due to the parasitic body diode in the MOSFET. If
this is a concern, the back-to-back configuration should
be used.
In a typical application of the MAX4846, an external
adapter with built-in battery charger is connected to IN
and a battery is connected to the source of the external
FET. When the adapter is unplugged, IN is directly con-
nected to the battery through the external FET. Since
the battery voltage is typically greater than 3V, the
GATE voltage stays high and the device remains pow-
ered by the battery.
MOSFET Selection
The MAX4843–MAX4846 are designed for use with
either a single n-channel MOSFET or dual back-to-back
n-channel MOSFETs. In most situations, MOSFETs with
R
ON
specified for a V
GS
of 4.5V work well. If the input
supply is near the UVLO maximum of 3.5V, consider
using a MOSFET specified for a lower V
GS
voltage.
Also the V
DS
should be 30V for the MOSFET to with-
stand the full 28V IN range of the MAX4843–MAX4846.
Table 1 shows a selection of MOSFETs appropriate for
use with the MAX4843–MAX4846.
IN Bypass Considerations
For most applications, bypass IN to GND with a 1µF
ceramic capacitor. If the power source has significant
inductance due to long lead length, take care to pre-
vent overshoots due to the LC tank circuit and provide
protection if necessary to prevent exceeding the 30V
absolute maximum rating on IN.
The MAX4843–MAX4846 provide protection against
voltage faults up to 28V, but this does not include nega-
tive voltages. If negative voltages are a concern, con-
nect a Schottky diode from IN to GND to clamp
negative input voltages.
ESD Test Conditions
ESD performance depends on a number of conditions.
The MAX4843–MAX4846 are protected from ±15kV typ-
ical ESD on IN when IN is bypassed to ground with a
1µF ceramic capacitor.
MAX4843–MAX4846
Overvoltage Protection Controllers with
Low Standby Current
_______________________________________________________________________________________ 7
MAX4843–
MAX4846
4
GATE
FLAG
V
IO
N
3
1
IN
2
GND
INPUT
+1.2V TO +28V
1μF
N
PART
CONFIGURATION/
PACKAGE
V
DS
MAX (V) R
ON
at 4.5V (m) MANUFACTURER
Si5902DC
Dual/1206-8
30 143
Si1426DH
Single/SSOT-6
30 115
Vishay Siliconix
www.vishay.com
FDC6561AN
Dual/SSOT-6
30 145
FDC6305N
Dual/SSOT-6
20 80
Fairchild Semiconductor
www.fairchildsemi.com
Figure 5. Back-to-Back External MOSFET Configuration
Table 1. MOSFET Suggestions
MAX4843–MAX4846
Human Body Model
Figure 6 shows the Human Body Model and Figure 7
shows the current waveform it generates when dis-
charged into a low impedance. This model consists
of a 100pF capacitor charged to the ESD voltage of
interest, which is then discharged into the device
through a 1.5kΩ resistor.
IEC 1000-4-2
Since January 1996, all equipment manufactured
and/or sold in the European Union has been required to
meet the stringent IEC 1000-4-2 specification. The IEC
1000-4-2 standard covers ESD testing and perfor-
mance of finished equipment; it does not specifically
refer to integrated circuits. The MAX4843–MAX4846
help users design equipment that meets Level 3 of IEC
1000-4-2, without additional ESD-protection compo-
nents.
The main difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak
current in IEC 1000-4-2. Because series resistance is
lower in the IEC 1000-4-2 ESD test model (Figure 8),
the ESD withstand voltage measured to this standard is
generally lower than that measured using the Human
Body Model. Figure 9 shows the current waveform for
the ±8kV IEC 1000-4-2 Level 4 ESD Contact Discharge
test. The Air-Gap test involves approaching the device
with a charger probe. The Contact Discharge method
connects the probe to the device before the probe is
energized.
Overvoltage Protection Controllers with
Low Standby Current
8 _______________________________________________________________________________________
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
C
s
100pF
R
C
1MΩ
R
D
1.5kΩ
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 6. Human Body ESD Test Model
I
P
100%
90%
36.8%
t
RL
TIME
t
DL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
I
r
10%
0
0
AMPERES
Figure 7. Human Body Model Current Waveform
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
C
s
150pF
R
C
50MΩ TO 100MΩ
R
D
330Ω
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 8. IEC 1000-4-2 ESD Test Model
100%
90%
60ns
10%
tr = 0.7ns to 1ns
I
PEAK
I
30ns
t
Figure 9. IEC 1000-4-2 ESD Generator Current Waveform
MAX4843–MAX4846
Overvoltage Protection Switches with
Low Standby Current
_______________________________________________________________________________________ 9
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
6 µDFN L611-1
21-0147
6 UTLGA Y61A1-1
21-0190

MAX4845EYT+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Current & Power Monitors & Regulators Overvoltage Protect Controller
Lifecycle:
New from this manufacturer.
Delivery:
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