AOL1440

Symbol
V
DS
V
GS
I
DM
I
AR
E
AR
T
J
, T
STG
Symbol Typ Max
19 25
45 55
R
θJC
1.5 2
I
DSM
21
A
T
A
=70°C 17
Maximum Junction-to-Ambient
A
Steady-State
°C/W
P
DSM
2.3
T
A
=70°C 1.4
-55 to 175
Pulsed Drain Current
Gate-Source Voltage
Power Dissipation
A
T
A
=25°C
Power Dissipation
B
T
C
=25°C
Continuous Drain
Current
G
T
A
=25°C
Maximum Junction-to-Case
C
Steady-State
°C/W
Thermal Characteristics
Parameter Units
Maximum Junction-to-Ambient
A
t 10s
R
θJA
°C/W
P
D
Avalanche Current
C
T
C
=100°C
Junction and Storage Temperature Range
Repetitive avalanche energy L=0.3mH
C
Continuous Drain
Current
B,G,
Maximum UnitsParameter
T
C
=25°C
G
T
C
=100°C
B
25
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
VDrain-Source Voltage
V±30
30 A
85
66
A
I
D
200
mJ
W
37
°C
75
W
135
AOL1440
N-Channel Enhancement Mode Field Effect Transistor
Features
V
DS
(V) = 25V
I
D
= 75A (V
GS
= 10V)
R
DS(ON)
< 3.2m (V
GS
= 20V)
R
DS(ON)
< 4.0mW (V
GS
= 10V)
R
DS(ON)
< 5.2mW (V
GS
= 12V)
UIS Tested
Rg,Ciss,Coss,Crss Tested
General Description
The AOL1440 uses advanced trench technology to
provide excellent R
DS(ON)
, shoot-through immunity and
body diode characteristics. This device is ideally suit
e
for use as a low side switch in CPU core power
conversion.
-RoHS Compliant
-Halogen and Antimony Free Green Device*
G
D
S
UltraSO-8
TM
Top View
Bottom tab
connected to
drai
n
S
G
D
Features
V
DS
(V) = 25V
I
D
= 75A (V
GS
= 10V)
R
DS(ON)
< 3.2m (V
GS
= 20V)
R
DS(ON)
< 4.0m (V
GS
= 12V)
R
DS(ON)
< 5.2m (V
GS
= 10V)
UIS Tested
Rg,Ciss,Coss,Crss Tested
Alpha & Omega Semiconductor, Ltd. www.aosmd.com
AOL1440
Symbol Min Typ Max Units
BV
DSS
25 V
0.005 1
T
J
=55°C
5
I
GSS
100 nA
V
GS(th)
234V
I
D(ON)
200 A
2.7 3.2
3.5 4
4 5.2
m
T
J
=125°C
5.6
m
g
FS
75 S
V
SD
0.7 1 V
I
S
55 A
C
iss
2100 2400 pF
C
oss
850 pF
C
rss
400 pF
R
g
0.35 1
Q
g
(12V)
40 50 nC
Q
g
(10V)
33 nC
Q
gs
11 nC
Q
gd
14 nC
t
D(on)
12 ns
t
r
19 ns
t
D(off)
15 ns
t
f
8.5 ns
t
rr
42
ns
Q
rr
34 nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
I
F
=20A, dI/dt=100A/µs
Drain-Source Breakdown Voltage
On state drain current
I
D
=250µA, V
GS
=0V
V
GS
=12V, V
DS
=5V
V
GS
=20V, I
D
=20A
Reverse Transfer Capacitance
I
F
=20A, dI/dt=100A/µs
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
I
DSS
µA
Gate Threshold Voltage V
DS
=V
GS
I
D
=250µA
V
DS
=20V, V
GS
=0V
V
DS
=0V, V
GS
= ±30V
Zero Gate Voltage Drain Current
Gate-Body leakage current
Forward Transconductance
Diode Forward Voltage
R
DS(ON)
Static Drain-Source On-Resistance
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
DYNAMIC PARAMETERS
m
I
S
=1A,V
GS
=0V
V
DS
=5V, I
D
=20A
V
GS
=10V, I
D
=20A
V
GS
=12V, I
D
=20A
Turn-On Rise Time
Turn-Off DelayTime
V
GS
=10V, V
DS
=12.5V, R
L
=0.68,
R
GEN
=3
Turn-Off Fall Time
Turn-On DelayTime
Gate Drain Charge
V
GS
=0V, V
DS
=12.5V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
Gate Source Charge
Gate resistance V
GS
=0V, V
DS
=0V, f=1MHz
Total Gate Charge
V
GS
=10V, V
DS
=12.5V, I
D
=20A
A: The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=175°C.
D. The R
θJA
is the sum of the thermal impedence from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=175°C.
G. The maximum current rating is limited by bond-wires.
H. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The SOA
curve provides a single pulse rating.
* This device is guaranteed green after date code 8P11 (June 1
ST
2008)
Rev1. June 2008
Alpha & Omega Semiconductor, Ltd. www.aosmd.com
AOL1440
T
C
=100°C
T
A
=25°C
-55 to 175
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
40
80
120
160
200
012345
V
DS
(Volts)
Figure 1: On-Region Characteristics
I
D
(A)
V
GS
=8V
10V
20V
12V
0
20
40
60
80
100
345678
V
GS
(Volts)
Figure 2: Transfer Characteristics
I
D
(A)
2.0
2.5
3.0
3.5
4.0
4.5
0 5 10 15 20 25 30
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
R
DS(ON)
(m
)
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.2 0.4 0.6 0.8 1.0 1.2
V
SD
(Volts)
Figure 6: Body-Diode Characteristics
I
S
(A)
25°C
125°C
0.6
0.8
1
1.2
1.4
-50 -25 0 25 50 75 100 125 150 175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
Normalized On-Resistance
V
GS
=10V
V
GS
=12V
V
GS
=20V
V
GS
=20V
V
GS
=12V
V
GS
=10V
2
4
6
8
10
12
14
6 8 10 12 14 16 18 20
V
GS
(Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
R
DS(ON)
(m
)
25°C
125°C
V
DS
=5V
V
GS
=12V
V
GS
=10V
I
D
=20A
25°C
125°C
I
D
=20A
V
GS
=20V
Alpha & Omega Semiconductor, Ltd. www.aosmd.com

AOL1440

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 25V 85A 8ULTRASO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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