LB T67C, LV T67C, LT T67C
2004-08-16 10
Zulässige Impulsbelastbarkeit I
F
= f (t
p
)
Permissible Pulse Handling Capability
Duty cycle D = parameter, T
A
= 25 °C, LB
Zulässige Impulsbelastbarkeit I
F
= f (t
p
)
Permissible Pulse Handling Capability
Duty cycle D = parameter, T
A
= 25 °C, LT, LV
Zulässige Impulsbelastbarkeit I
F
= f (t
p
)
Permissible Pulse Handling Capability
Duty cycle D = parameter, T
A
= 85 °C, LB
Zulässige Impulsbelastbarkeit I
F
= f (t
p
)
Permissible Pulse Handling Capability
Duty cycle D = parameter, T
A
= 85 °C, LT, LV
OHL01961
I
10
0.01
10
-4-5
10 10
0.15
0.10
0.05
0
10-1-2-3
10 10 10
t
p
10 s
0.02
0.05
0.5
0.2
0.1
1
0.35
0.25
0.20
I
F
A
D
0.005
P
t
D
=
T
=
T
t
P
2
F
OHL01963
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.45
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
1
OHL01962
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.05
0.10
0.15
0.20
0.25
0.35
1
OHL01964
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.45
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
1
LB T67C, LV T67C, LT T67C
2004-08-16 11
Maßzeichnung
8)
Seite 17
Package Outlines
8) page 17
Kathodenkennung: abgeschrägte Ecke
Cathode mark: bevelled edge
Gewicht / Approx. weight: 35 mg
Gurtung / Polarität und Lage
8)
Seite 17
Verpackungseinheit 2000/Rolle, ø180 mm
oder 8000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation
8) page 17
Packing unit 2000/reel, ø180 mm
or 8000/reel, ø330 mm
GPLY6724
0.7 (0.028)
0.9 (0.035)
1.7 (0.067)
2.1 (0.083)
0.12 (0.005)
0.18 (0.007)
0.5 (0.020)
1.1 (0.043)
3.3 (0.130)
3.7 (0.146)
0.4 (0.016)
0.6 (0.024)
2.6 (0.102)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
C
athode marking
3.0 (0.118)
3.4 (0.134)
(2.4) (0.095)
0.1 (0.004) (typ.)
4˚±1
A
C
OHAY227
3.6 (0.142)
8 (0.315)
3.5 (0.138)
1.75 (0.069)
2.9 (0.114)
4 (0.157)
2004-08-16 12
LB T67C, LV T67C, LT T67C
Empfohlenes Lötpaddesign
8) 9)
Seite 17
IR Reflow Löten
Recommended Solder Pad
8) 9) page 17
IR Reflow Soldering
Empfohlenes Lötpaddesign verwendbar für TOPLED
®
und Power TOPLED
®
IR Reflow Löten
8)
Seite 17
Recommended Solder Pad useable for TOPLED
®
and Power TOPLED
®
IR Reflow Soldering
8) page 17
OHLPY97
0
4.5 (0.177)
2.6 (0.102)
1.5 (0.059)
Cu-area > 16 mm
Cu-Fläche > 16 mm
2
2
Solder resist
Lötstopplack
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
OHLPY440
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
0.8 (0.031)
3.7 (0.146)
1.1 (0.043)
2.3 (0.091)
3.3 (0.130)
1.5 (0.059)
11.1 (0.437)
Cu Fläche / 16 mm per pad
2
Cu-area
_
<
3.3 (0.130)
Kathode/
Cathode
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.7 (0.028)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.

LV T67C-T1U2-35-Z

Mfr. #:
Manufacturer:
OSRAM Opto Semiconductors
Description:
Standard LEDs - SMD Verde Green, 505nm 710mcd, 20mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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