PRF18BB471QB1RB

Reference standard: IEC 60068-2-2 (2007)

· Soldered PTC to PCB (**)

· +85±2°C

· Applied max. voltage

· 1000+48/-0 hrs.

10 High Temperature Load

Reference standard: IEC 60068-2-14 (2009)

[ Test Na ]

· Soldered PTC to PCB (**)

· +40±2°C, 90±5%RH

· 500+24/-0 hrs

8 Damp Heat, Steady State

Reference standard: IEC 60068-2-1 (2007)

· Soldered PTC to PCB (**)

· -20±3°C

· 1000+48/-0 hrs

7 Low Temperature Storage

Reference standard: IEC 60068-2-2 (2007)

· Soldered PTC to PCB (**)

[ Solder bath method ]

· Solder: Sn-3.0Ag-0.5Cu

· Preheat: 150±5°C, 90 to 120s

· Solder temp.: 260±5°C

· Immersion time: 10±1s

5 Resistance to Soldering Heat

· Appearance: No defects or abnormalities

· Resistance (R25) change: Less than ±20% (*)

Reference standard: IEC 60068-2-58 (2004)

· Solder: Sn-3.0Ag-0.5Cu

· Frequency range: 10 to 55Hz

· Amplitude: 1.5mm

· Sweep rate: 1 octave/min.

· Direction: X-Y-Z (3 direction)

· 24 cycles in each axis

3 Vibration

· Appearance: No defects or abnormalities

· Resistance (R25) change: Less than ±20% (*)

*: The resistance value after the test. It is measured by applying voltage less than DC1.5V (by a direct current less than 10mA) after left at 25±2°C for 2hrs.

**: Above mentioned soldering is done under the following conditions at our side.

-20±3°C

+150±2°C

30min.

30min.

Reference standard: IEC 60068-2-21 (2006)

· Soldered PTC to PCB (**)

· Force: 5.0N

· Test time: 10 sec.

2 Adhesive Strength

There is no sign of exfoliation on electrode.

c PRF18/21_471Q Series