Package mechanical data DA108S1 / DA112S1
6/8
3 Package mechanical data
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Figure 8. SO-8 footprint dimensions in mm (inches)
Table 4. SO-8 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A1.750.069
A1 0.1 0.25 0.004 0.010
A2 1.25 0.049
b 0.28 0.48 0.011 0.019
C 0.17 0.23 0.007 0.009
D 4.80 4.90 5.00 0.189 0.193 0.197
E 5.80 6.00 6.20 0.228 0.236 0.244
E1 3.80 3.90 4.00 0.150 0.154 0.157
e 1.27 0.050
h 0.25 0.50 0.010 0.020
L 0.40 1.27 0.016 0.050
L1 1.04 0.041
k°0808
ccc 0.10 0.004
E1
D
8
4
1
5
E
e
A
A2
b
A1
ccc C
k
h x 45°
L
L1
C
(Seating
Plane)
0.25mm
(Gage Plane)
C
6.8
(0.268)
4.2
(0.165)
1.27
(0.050)
0.6
(0.024)
