SI3483CDV-T1-E3

Vishay Siliconix
Si3483CDV
Document Number: 68603
S09-0660-Rev. B, 20-Apr-09
www.vishay.com
1
New Product
P-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFET
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Load Switch
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A) Q
g
(Typ.)
- 30
0.034 at V
GS
= - 10 V
- 8
a
11.5 nC
0.053 at V
GS
= - 4.5 V
- 7
(4) S
(3) G
(1, 2, 5, 6) D
TSOP-6
Top View
6
4
1
2
3
5
Ordering Information: Si3483CDV-T1-E3 (Lead (Pb)-free)
Si3483CDV-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
3 mm
2.85 mm
Marking Code
AU XXX
Lot Traceability
and Date Code
Part # Code
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under Steady State conditions is 110 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 8
a
A
T
C
= 70 °C
- 7
T
A
= 25 °C
- 6.1
b, c
T
A
= 70 °C
- 4.9
b, c
Pulsed Drain Current
I
DM
- 25
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 3.5
T
A
= 25 °C
- 1.67
b, c
Maximum Power Dissipation
T
C
= 25 °C
P
D
4.2
W
T
C
= 70 °C
2.7
T
A
= 25 °C
2.0
b, c
T
A
= 70 °C
1.3
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 5 s
R
thJA
55 62.5
°C/W
Maximum Junction-to-Foot (Drain)
Steady State
R
thJF
25 30
www.vishay.com
2
Document Number: 68603
S09-0660-Rev. B, 20-Apr-09
Vishay Siliconix
Si3483CDV
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 32
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
5
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 1.0 - 3.0 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 30 V, V
GS
= 0 V
- 1
µA
V
DS
= - 30 V, V
GS
= 0 V, T
J
= 85 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
- 5 V, V
GS
= - 10 V
- 20 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V, I
D
= - 6.1 A
0.027 0.034
Ω
V
GS
= - 4.5 V, I
D
= - 2 A
0.044 0.053
Forward Transconductance
a
g
fs
V
DS
= - 15 V, I
D
= - 6.1 A
13 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 15 V, V
GS
= 0 V, f = 1 MHz
1000
pFOutput Capacitance
C
oss
170
Reverse Transfer Capacitance
C
rss
140
Total Gate Charge
Q
g
V
DS
= - 15 V, V
GS
= - 10 V, I
D
= - 6.1 A
22 33
nC
V
DS
= - 15 V, V
GS
= - 4.5 V, I
D
= - 6.1 A
11.5 18
Gate-Source Charge
Q
gs
3.4
Gate-Drain Charge
Q
gd
5.7
Gate Resistance
R
g
f = 1 MHz 5.6 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 3.1 Ω
I
D
- 4.9 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
45 70
ns
Rise Time
t
r
135 205
Turn-Off Delay Time
t
d(off)
25 40
Fall Time
t
f
15 25
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 3.1 Ω
I
D
- 4.9 A, V
GEN
= - 10 V, R
g
= 1 Ω
10 15
Rise Time
t
r
15 25
Turn-Off Delay Time
t
d(off)
30 45
Fall Time
t
f
10 15
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 3.5
A
Pulse Diode Forward Current
a
I
SM
- 25
Body Diode Voltage
V
SD
I
S
= - 4.9 A
- 0.8 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 4.9 A, dI/dt = 100 A/µs, T
J
= 25 °C
25 50 ns
Body Diode Reverse Recovery Charge
Q
rr
17 35 nC
Reverse Recovery Fall Time
t
a
14
ns
Reverse Recovery Rise Time
t
b
11
Document Number: 68603
S09-0660-Rev. B, 20-Apr-09
www.vishay.com
3
Vishay Siliconix
Si3483CDV
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
5
10
15
20
25
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)
I
D
V
GS
= 10 V thru 5 V
V
GS
= 4 V
V
GS
= 3 V
V
GS
= 2 V
0.00
0.02
0.04
0.06
0.08
0.10
0 5 10 15 20 25
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
V
GS
= 10 V
V
GS
= 4.5 V
0
2
4
6
8
10
0 5 10 15 20 25
I
D
= 6.1 A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 24 V
V
DS
= 15 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
1
2
3
4
5
01234
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
C
rss
0
300
600
900
1200
1500
1800
0 5 10 15 20 25 30
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
T
J
- Junction Temperature (°C)
(Normalized)
- On-Resistance R
DS(on)
V
GS
= 4.5 V
I
D
= 6.1 A
V
GS
= 10 V

SI3483CDV-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -30V Vds 20V Vgs TSOP-6
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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