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74HCT541N,652
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P19
74HC_HCT541
All informatio
n provided in this d
ocument is su
bject to legal discl
aimers.
© NXP Semiconduc
tors N.V
. 2015. All rights
rese
rved.
Product data sheet
Rev
. 3
.1 — 28 August 2015
13 of 19
NXP Semiconductors
74HC541; 74HCT541
Oct
al buffer/line driver; 3-
st
ate
Fig 10.
Package
outline SOT163-1 (SO2
0)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
Q
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w
M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04
MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
99-12-27
03-02-19
74HC_HCT541
All informatio
n provided in this d
ocument is su
bject to legal discl
aimers.
© NXP Semiconduc
tors N.V
. 2015. All rights
rese
rved.
Product data sheet
Rev
. 3
.1 — 28 August 2015
14 of 19
NXP Semiconductors
74HC541; 74HCT541
Oct
al buffer/line driver; 3-
st
ate
Fig 1
1.
Package
outline SOT339-1 (SSOP20
)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
Q
(1)
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
0.9
0.7
0.9
0.5
8
0
o
o
0.13
1.25
0.2
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1
MO-150
99-12-27
03-02-19
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
11
0
20
11
y
0.25
pin 1 index
0
2.5
5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
A
max.
2
74HC_HCT541
All informatio
n provided in this d
ocument is su
bject to legal discl
aimers.
© NXP Semiconduc
tors N.V
. 2015. All rights
rese
rved.
Product data sheet
Rev
. 3
.1 — 28 August 2015
15 of 19
NXP Semiconductors
74HC541; 74HCT541
Oct
al buffer/line driver; 3-
st
ate
Fig 12.
Package ou
tline SOT360-1 (TSSOP20)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1
MO-153
99-12-27
03-02-19
w
M
b
p
D
Z
e
0.25
11
0
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P19
74HCT541N,652
Mfr. #:
Buy 74HCT541N,652
Manufacturer:
NXP Semiconductors
Description:
Buffers & Line Drivers OCTAL BUFF/LDRVR 3ST
Lifecycle:
New from this manufacturer.
Delivery:
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