MID Package AAM11
–3–
ACCTB96E 201609-T
2. Individual piece (cut shape)
NOTES
General tolerance: ±0.1
0.7 dia.
2.3
(Including pattern)
C
C
0.9
1.95
Taper 0.5°
0.1
(Cut width)
0.075 (Gap distance)
0.366
(WB area)
(2.3)
(0.17)
(2.28)
0.1
(Cut width)
0.227
(WB area)
Detail drawing A C-C cross section
0.3 (TOP-WB)
H (TOP-DB)
(Including individual piece height and pattern)
1. Handling during storage
1) Although the outermost surface is coated in Au-plating, if
exposed to atmospheres containing corrosive gases, humidity or
at high temperature, the underlying nickel or copper may corrode
causing discoloration of the plated surface, decreasing
reflectance, and this may lead to decreased mountability or joint
reliability of LED components or soldering. Therefore, please
pay close attention to the atmosphere used for storage.
2) Storage conditions (“After opening” refers to after opening the
packing bag)
The following conditions must be followed in order to maintain
plating adhesive strength and external performance.
*1: Please keep it in desiccator set into the clean room.
*2: The storage life means the length from the date (lot number) printed on
packaging.
2. Soldering
Please use the reflow temperature profile conditions
recommended below for reflow soldering. Please contact us
before using a temperature profile other than that described
below.
Recommended soldering temperature conditions
Before opening After opening
Temperature 15°C to 35°C23°C±3°C
Humidity RH25% to 75% RH50% or less
Pressure 86 kPa to 106 kPa 86 kPa to 106 kPa
Storage life (*2) 3 months 1 month (*1)
Please refer to the latest product specifications when
designing your product.
40 sec or less
10 sec or less
70 sec or less
60 to
110 sec
Times, sec
260
250
200
180
130
~150
40
Surface temperature of molded
components (package), °C
