4
FN9165.1
May 4, 2007
Absolute Maximum Ratings Thermal Information
Supply Voltage (PVCC, VCC) . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V
EN
, V
PWM
) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V
BOOT-GND
). . . -0.3V to 25V (DC) or 36V (<200ns)
BOOT To PHASE Voltage (V
BOOT-PHASE
). . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 15V (DC)
GND -8V (<20ns Pulse Width, 10μJ) to 30V (<100ns)
UGATE Voltage . . . . . . . . . . . . . . . . V
PHASE
- 0.3V (DC) to V
BOOT
V
PHASE
- 5V (<20ns Pulse Width, 10μJ) to V
BOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5μJ) to VCC + 0.3V
Ambient Temperature Range. . . . . . . . . . . . . . . . . .-40°C to +125°C
HBM ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV
Thermal Resistance (Notes 1 and 2) θ
JA
(°C/W) θ
JC
(°C/W)
QFN Package. . . . . . . . . . . . . . . . . . 46 8.5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Recommended Operating Conditions
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
+150°C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Constantly operated at +150°C may shorten the life of the part.
NOTES:
1. θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
2. θ
JC
, “case temperature” location is at the center of the package underside exposed pad. See Tech Brief TB379 for details.
Electrical Specifications These specifications apply for T
A
= 0°C to +70°C, unless otherwise noted
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Bias Supply Current I
VCC+PVCC
PWM pin floating, V
VCC
= V
PVCC
= 5V - 350 - μA
F
PWM
= 300kHz, V
VCC
= V
PVCC
= 5V - 1.7 - mA
POR Rising -3.44.2V
POR Falling 2.6 3.0 - V
Hysteresis - 400 - mV
BOOTSTRAP DIODE
Forward Voltage V
F
Forward bias current = 2mA 0.3 0.6 0.7 V
VCTRL INPUT
Turn-On Threshold 2.5 2.8 - V
Hysteresis - 100 - mV
ENABLE INPUT
EN LOW Threshold 1.00 1.34 - V
EN HIGH Threshold 1.40 1.60 - V
EN Hysteresis 100 260 - mV
PWM INPUT
Sinking Impedance R
PWM_SNK
-3.5-kΩ
Source Impedance R
PWM_SRC
-3.5-kΩ
Tri-State Lower Threshold V
VCC
= 3.3V (120mV Hysteresis) - 1.15 1.4 V
V
VCC
= 5V (300mV Hysteresis) - 1.55 1.75 V
Tri-State Upper Threshold V
VCC
= 3.3V (110mV Hysteresis) 1.65 1.85 - V
V
VCC
= 5V (300mV Hysteresis) 3.00 3.18 - V
Tri-State Shutdown Holdoff Time t
TSSHD
-80-ns
SWITCHING TIME (Note 3, See Figure 1)
UGATE Rise Time t
RU
V
VCC
= 5V, 3nF Load - 8.0 - ns
LGATE Rise Time t
RL
V
VCC
= 5V, 3nF Load - 8.0 - ns
UGATE Fall Time t
FU
V
VCC
= 5V, 3nF Load - 8.0 - ns
ISL6597
5
FN9165.1
May 4, 2007
Functional Pin Description
LGATE Fall Time t
FL
V
VCC
= 5V, 3nF Load - 4.0 - ns
UGATE Turn-Off Propagation Delay t
PDLU
V
VCC
= 5V, Unloaded, - 18 - ns
LGATE Turn-Off Propagation Delay t
PDLL
V
VCC
= 5V, Unloaded, - 25 - ns
UGATE Turn-On Propagation Delay t
PDHU
V
VCC
= 5V, Unloaded, - 18 - ns
LGATE Turn-On Propagation Delay t
PDHL
V
VCC
= 5V, Unloaded, - 23 - ns
Tri-state to UG/LG Rising Propagation Delay t
PTS
V
VCC
= 5V, Unloaded - 30 - ns
OUTPUT (Note 3)
Upper Drive Source Resistance R
UG_SRC
250mA Source Current - 1.0 2.5 Ω
Upper Drive Sink Resistance R
UG_SNK
250mA Sink Current - 1.0 2.5 Ω
Lower Drive Source Resistance R
LG_SRC
250mA Source Current - 1.0 2.5 Ω
Lower Drive Sink Resistance R
LG_SNK
250mA Sink Current - 0.4 1.0 Ω
NOTE:
3. Guaranteed by Characterization. Not 100% tested in production.
Electrical Specifications These specifications apply for T
A
= 0°C to +70°C, unless otherwise noted (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
PACKAGE
PIN #
PIN
SYMBOL FUNCTION
1 GND Bias and reference ground. All signals are referenced to this node.
2 LGATE1 Lower gate drive output of Channel 1. Connect to gate of the low-side power N-Channel MOSFET.
3 PVCC This pin supplies power to both the lower and higher gate drives. Place a high quality low ESR ceramic capacitor from
this pin to PGND.
4EN
Enable input pin. Connect this pin high to enable and low to disable the driver.
5 PGND It is the power ground return of both low gate drivers.
6 LGATE2 Lower gate drive output of Channel 2. Connect to gate of the low-side power N-Channel MOSFET.
7 VCTRL This pin sets the PWM logic threshold. Connect this pin to 3.3V source for 3.3V PWM input and pull it to 5V source for
5V PWM input.
8 PHASE2 Connect this pin to the SOURCE of the upper MOSFET and the DRAIN of the lower MOSFET in Channel 2. This pin
provides a return path for the upper gate drive.
9 UGATE2 Upper gate drive output of Channel 2. Connect to gate of high-side power N-Channel MOSFET.
10 BOOT2 Floating bootstrap supply pin for the upper gate drive of Channel 2. Connect the bootstrap capacitor between this pin
and the PHASE2 pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See “Bootstrap
Considerations” on page 7 for guidance in choosing the capacitor value.
11 BOOT1 Floating bootstrap supply pin for the upper gate drive of Channel 1. Connect the bootstrap capacitor between this pin
and the PHASE1 pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See “Bootstrap
Considerations” on page 7 for guidance in choosing the capacitor value.
12 UGATE1 Upper gate drive output of Channel 1. Connect to gate of high-side power N-Channel MOSFET.
13 PHASE1 Connect this pin to the SOURCE of the upper MOSFET and the DRAIN of the lower MOSFET in Channel 1. This pin
provides a return path for the upper gate drive.
14 VCC Connect this pin to a +5V bias supply. It supplies power to internal analog circuits. Place a high quality low ESR ceramic
capacitor from this pin to GND.
15 PWM1 The PWM signal is the control input for the Channel 1 driver. The PWM signal can enter three distinct states during operation,
see “Tri-State PWM Input” on page 6 for further details. Connect this pin to the PWM output of the controller.
16 PWM2 The PWM signal is the control input for the Channel 2 driver. The PWM signal can enter three distinct states during operation,
see “Tri-State PWM Input” on page 6 for further details. Connect this pin to the PWM output of the controller.
17 PAD Connect this pad to the power ground plane (PGND) via thermally enhanced connection.
ISL6597
6
FN9165.1
May 4, 2007
Timing Diagram
Operation and Adaptive Shoot-Through Protection
Designed for high speed switching, the ISL6597 MOSFET
driver controls both high-side and low-side N-Channel FETs
from one externally provided PWM signal.
A rising transition on PWM initiates the turn-off of the lower
MOSFET (see Figure 1). After a short propagation delay
[t
PDLL
], the lower gate begins to fall. Typical fall times [t
FL
]
are provided in the Electrical Specifications. Adaptive shoot-
through circuitry monitors the LGATE voltage and turns on
the upper gate following a short delay time [t
PDHU
] after the
LGATE voltage drops below ~1V. The upper gate drive then
begins to rise [t
RU
] and the upper MOSFET turns on.
A falling transition on PWM indicates the turn-off of the upper
MOSFET and the turn-on of the lower MOSFET. A short
propagation delay [t
PDLU
] is encountered before the upper
gate begins to fall [t
FU
]. The adaptive shoot-through circuitry
monitors the UGATE-PHASE voltage and turns on the lower
MOSFET a short delay time, t
PDHL
, after the upper
MOSFET’s gate voltage drops below 1V. The lower gate
then rises [t
RL
], turning on the lower MOSFET. These
methods prevent both the lower and upper MOSFETs from
conducting simultaneously (shoot-through), while adapting
the dead time to the gate charge characteristics of the
MOSFETs being used.
This driver is optimized for voltage regulators with large step
down ratio. The lower MOSFET is usually sized larger
compared to the upper MOSFET because the lower
MOSFET conducts for a longer time during a switching
period. The lower gate driver is therefore sized much larger
to meet this application requirement. The 0.4Ω on-resistance
and 4A sink current capability enable the lower gate driver to
absorb the current injected into the lower gate through the
drain-to-gate (C
GD
) capacitor of the lower MOSFET and
help prevent shoot through caused by the self turn-on of the
lower MOSFET due to high dV/dt of the switching node.
Tri-State PWM Input
A unique feature of the ISL6597 is the programmable PWM
logic threshold set by the control pin (VCTRL) voltage. The
VCTRL pin should connect to the controller’s VCC so that
the PWM logic thresholds follow with the VCC voltage level.
For applications using single rail 5V to power up both
controller and driver, this pin can be tied to the driver VCC,
simplifying the trace routing.
The ISL6597 also features the adaptable tri-state PWM
input. Once the PWM signal enters the shutdown window,
either MOSFET previously conducting is turned off. If the
PWM signal remains within the shutdown window for longer
than the gate turn-off propagation delay of the previously
conducting MOSFET, the output drivers are disabled and
both MOSFET gates are pulled and held low. The shutdown
state is removed when the PWM signal moves outside the
shutdown window. The PWM rising and falling thresholds
outlined in the Electrical Specifications determine when the
lower and upper gates are enabled. During normal operation
in a typical application, the PWM rise and fall times through
the shutdown window should not exceed either output’s turn-
off propagation delay plus the MOSFET gate discharge time
to ~1V. Abnormally long PWM signal transition times through
the shutdown window will simply introduce additional dead
time between turn off and turn on of the synchronous
bridge’s MOSFETs. For optimal performance, no more than
50pF parasitic capacitive load should be present on the
PWM
UGATE
LGATE
t
PDLL
t
PDHU
t
RU
t
PDLU
t
PDHL
t
RL
1V
2.5V
t
RU
t
FU
t
FL
1V
t
PTS
t
TSSHD
t
TSSHD
t
PTS
FIGURE 1. TIMING DIAGRAM
ISL6597

ISL6597CRZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers DL 5V DRVRS W/BOOTS DESKTOP COMPTING 4X4
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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