NTR4171PT1G

© Semiconductor Components Industries, LLC, 2007
October, 2016 Rev. 2
1 Publication Order Number:
NTR4171P/D
NTR4171P
Power MOSFET
30 V, 3.5 A, Single PChannel, SOT23
Features
Low R
DS(on)
at Low Gate Voltage
Low Threshold Voltage
High Power and Current Handling Capability
This is a PbFree Device
Applications
Load Switch
Optimized for Battery and Load Management Applications in
Portable Equipment like Cell Phones, PDAs, Media Players, etc.
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DraintoSource Voltage V
DSS
30 V
GatetoSource Voltage V
GS
±12 V
Continuous Drain
Current (Note 1)
Steady
State
T
A
= 25°C
I
D
2.2
A
T
A
= 85°C 1.5
t 5 s T
A
= 25°C 3.5
Power Dissipation
(Note 1)
Steady
State
T
A
= 25°C P
D
0.48
W
t 5 s 1.25
Pulsed Drain Current
t
p
=10 ms
I
DM
15.0 A
Operating Junction and Storage Temperature T
J
,
T
stg
55 to
150
°C
Source Current (Body Diode) I
S
1.0 A
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS
Parameter Symbol Max Unit
JunctiontoAmbient Steady State (Note 1)
R
q
JA
260
°C/W
JunctiontoAmbient t 10 s (Note 1)
R
q
JA
100
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces)
G
S
D
Device Package Shipping
ORDERING INFORMATION
www.onsemi.com
30 V 110 mW @ 4.5 V
75 mW @ 10 V
R
DS(on)
MAX
2.2 A
I
D
MAXV
(BR)DSS
SOT23
CASE 318
STYLE 21
MARKING DIAGRAM/
PIN ASSIGNMENT
2
3
1
3
Drain
1
Gate
2
Source
PCHANNEL MOSFET
NTR4171PT1G SOT23
(PbFree)
3000/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
150 mW @ 2.5 V
TRFMG
G
TRF = Specific Device Code
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
1.8 A
1.0 A
NTR4171PT3G SOT23
(PbFree)
10000/Tape & Reel
NTR4171P
www.onsemi.com
2
MOSFET ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Parameter Symbol Test Condition Min Typ Max Units
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
30 V
DraintoSource Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/T
J
I
D
= 250 mA, Reference to 25°C
24 mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V, V
DS
= 24 V, T
J
= 25°C
V
GS
= 0 V, V
DS
= 24 V, T
J
= 85°C
1.0
5.0
mA
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= "12 V ±0.1
mA
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
0.7 1.15 1.4 V
Negative Threshold Temperature Coefficient V
GS(TH)
/T
J
3.5 mV/°C
DraintoSource OnResistance R
DS(on)
V
GS
= 10 V, I
D
= 2.2 A 50 75
mW
V
GS
= 4.5 V, I
D
= 1.8 A 60 110
V
GS
= 2.5 V, I
D
= 1.0 A 90 150
Forward Transconductance g
FS
V
DS
= 5.0 V, I
D
= 2.2 A 7.0 S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
C
iss
V
GS
= 0 V, f = 1.0 MHz,
V
DS
= 15 V
720
pF
Output Capacitance C
oss
95
Reverse Transfer Capacitance C
rss
65
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 15 V,
I
D
= 3.5 A
15.6
nC
Threshold Gate Charge Q
G(TH)
0.7
GatetoSource Charge Q
GS
1.6
GatetoDrain Charge Q
GD
2.6
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 15 V,
I
D
= 3.5 A
7.4
nC
Threshold Gate Charge Q
G(TH)
0.7
GatetoSource Charge Q
GS
1.6
GatetoDrain Charge Q
GD
2.6
Gate Resistance R
G
6.1
W
SWITCHING CHARACTERISTICS, V
GS
= 4.5 V (Note 4)
TurnOn Delay Time
t
d(on)
V
GS
= 10 V, V
DS
= 15 V,
I
D
= 3.5 A, R
G
= 6 W
8.0
ns
Rise Time t
r
11
TurnOff Delay Time t
d(off)
32
Fall Time t
f
14
TurnOn Delay Time t
d(on)
V
GS
= 4.5 V, V
DS
= 15 V,
I
D
= 3.5 A, R
G
= 6 W
9.0
ns
Rise Time t
r
16
TurnOff Delay Time t
d(off)
25
Fall Time t
f
22
DRAINSOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V, I
S
= 1.0 A, T
J
= 25°C 0.8 1.2 V
Reverse Recovery Time t
RR
V
GS
= 0 V, I
S
= 1.0 A,
dI
SD
/d
t
= 100 A/ms
14
ns
Charge Time t
a
10
Discharge Time t
b
4.0
Reverse Recovery Charge Q
RR
8.0 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces)
3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%
4. Switching characteristics are independent of operating junction temperatures
NTR4171P
www.onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAINTOSOURCE VOLTAGE (V) V
GS
, GATETOSOURCE VOLTAGE (V)
5.04.53.02.01.51.00.50
0
1.0
2.0
4.0
6.0
7.0
8.0
10
3.02.52.252.01.751.51.251.0
0
1.0
2.0
3.0
6.0
7.0
8.0
10
Figure 3. OnResistance vs. GatetoSource
Voltage
Figure 4. OnResistance vs. Drain Current and
Gate Voltage
V
GS
, GATE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
9.08.06.05.04.03.02.01.0
0
0.05
0.10
0.15
0.20
0.25
0.30
9.07.06.04.03.02.01.00
0
0.05
0.10
0.15
0.20
0.25
0.30
Figure 5. OnResistance Variation with
Temperature
Figure 6. DraintoSource Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAINTOSOURCE VOLTAGE (V)
12510075502502550
0.6
0.7
0.8
0.9
1.0
1.3
1.4
1.6
30252015105.00
10
100
1000
10,000
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (W)R
DS(on)
, NORMALIZED DRAINTOSOURCE RESISTANCE (W)
I
DSS
, LEAKAGE (nA)
2.5 4.03.5
3.0
5.0
9.0
V
GS
= 2.0 V
2.2 V
2.5 V
10 V
4.5 V
2.75
4.0
5.0
9.0
V
DS
= 5 V
T
J
= 25°C
T
J
= 125°C
T
J
= 55°C
7.0 10
T
J
= 25°C
I
D
= 2.2 A
R
DS(on)
, DRAINTOSOURCE RESISTANCE (W)
5.0 8.0 10
T
J
= 25°C
V
GS
= 10 V
2.2 V
2.5 V
4.5 V
2.0 V
150
V
GS
= 4.5 V
I
D
= 2.2 A
1.1
1.2
1.5
T
J
= 125°C
T
J
= 150°C

NTR4171PT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET PFET SOT23 30V TR 0.075R
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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