2003 Nov 24 4
NXP Semiconductors Product data sheet
PNP transistor/Schottky-diode module PMEM4020PD
THERMAL CHARACTERISTICS
Notes
1. For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses
P
R
are a significant part of the total power losses. Nomograms for determination of the reverse power losses P
R
and
I
F
(AV) rating will be available on request.
2. Solder point of collector or cathode tab.
3. Device mounted on a ceramic printed-circuit board; single-sided copper; tinplated; standard footprint.
4. Device mounted on a FR4 printed-circuit board; single-sided copper; tinplated; mounting pad for collector and
cathode both 1 cm
2
.
5. Device mounted on a FR4 printed-circuit board, single-sided copper; tinplated; standard footprint for SOT457.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Single device
R
th(j-s)
thermal resistance from junction to
solder point
in free air; notes 1 and 2 95 K/W
R
th(j-a)
thermal resistance from junction to
ambient
in free air; notes 1 and 3 250 K/W
in free air; notes 1 and 4 315 K/W
in free air; notes 1 and 5 425 K/W
Combined device
R
th(j-a)
thermal resistance from junction to
ambient
in free air; notes 1 and 3 208 K/W