SCA720-D01
Murata Electronics Oy 13/13
www.muratamems.fi Doc. nr. 82171500 Rev.A
Notes:
• Preheating time and temperatures according to guidance from solder paste
manufacturer.
• It is important that the part is parallel to the PCB plane and that there is no angular
alignment error from intended measuring direction during assembly process.
• Wave soldering is not recommended.
• Ultrasonic cleaning is not allowed. The sensing element may be damaged by an
ultrasonic cleaning process
The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-
020B. The part should be delivered in a dry pack. The manufacturing floor time (out of
bag) in the customer’s end is 168 hours. Maximum soldering temperature is
250 °C/40 sec.
Rework after the initial soldering process is not recommended. Rework can cause heat
build-up to the leg and this heat build-up will cause the housing material to get soft
thus allowing the leg to move. The movement can cause bond wire disconnection
inside the part.
