PBSS305PX_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 8 December 2009 3 of 15
NXP Semiconductors
PBSS305PX
80 V, 4.0 A PNP low V
CEsat
(BISS) transistor
5. Limiting values
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
[3] Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 80 V
V
CEO
collector-emitter voltage open base - 80 V
V
EBO
emitter-base voltage open collector - 5V
I
C
collector current - 4A
I
CM
peak collector current single pulse;
t
p
1ms
- 8A
P
tot
total power dissipation T
amb
25 °C
[1]
-0.6W
[2]
-1.65W
[3]
-2.1W
T
j
junction temperature - 150 °C
T
amb
ambient temperature 65 +150 °C
T
stg
storage temperature 65 +150 °C
(1) Ceramic PCB, Al
2
O
3
, standard footprint
(2) FR4 PCB, mounting pad for collector 6 cm
2
(3) FR4 PCB, standard footprint
Fig 1. Power derating curves
006aaa556
T
amb
(°C)
75 17512525 7525
1.0
0.5
1.5
2.0
2.5
P
tot
(W)
0
(3)
(2)
(1)
PBSS305PX_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 8 December 2009 4 of 15
NXP Semiconductors
PBSS305PX
80 V, 4.0 A PNP low V
CEsat
(BISS) transistor
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
[3] Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
--208K/W
[2]
--76K/W
[3]
--60K/W
R
th(j-sp)
thermal resistance from
junction to solder point
--20K/W
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aaa557
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
0.20
0.10
10
2
10
10
3
Z
th(j-a)
(K/W)
1
0
0.05
0.02
0.01
δ = 1
0.75
0.50
0.33
PBSS305PX_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 8 December 2009 5 of 15
NXP Semiconductors
PBSS305PX
80 V, 4.0 A PNP low V
CEsat
(BISS) transistor
FR4 PCB, mounting pad for collector 6 cm
2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
Ceramic PCB, Al
2
O
3
, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aaa558
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
0.01
0.05
0.10
0.20
0.33
δ = 1
0.02
10
1
10
2
Z
th(j-a)
(K/W)
10
1
0
0.75
0.50
006aaa559
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
0.33
0.10
0
0.01
0.02
10
1
10
2
Z
th(j-a)
(K/W)
10
1
0.05
δ = 1
0.75
0.50
0.20

PBSS305PX,115

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - BJT PNP 80V 4A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet