APTGT225A170G

APTGT225A170G
APTGT225A170G – Rev 2 October, 2012
www.microsemi.com
1-6
Absolute maximum ratings
Symbol Parameter Max ratings Unit
V
CES
Collector - Emitter Breakdown Voltage 1700 V
T
C
= 25°C
340
I
C
Continuous Collector Current
T
C
= 80°C
225
I
CM
Pulsed Collector Current T
C
= 25°C 450
A
V
GE
Gate – Emitter Voltage ±20 V
P
D
Maximum Power Dissipation
T
C
= 25°C
1250 W
RBSOA Reverse Bias Safe Operating Area T
j
= 125°C 450A @ 1600V
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
Q2
0/VBUS
Q1
VBUS
OUT
G1
G2
E2
E1
V
CES
= 1700V
I
C
= 225A @ Tc = 80°C
Application
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
Features
Trench + Field Stop IGBT3
Technology
- Low voltage drop
- Low tail current
- Switching frequency up to 20 kHz
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- RBSOA and SCSOA rated
Kelvin emitter for easy drive
Very low stray inductance
- Symmetrical design
- M5 power connectors
High level of integration
Benefits
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Easy paralleling due to positive TC of VCEsat
Low profile
RoHS Compliant
Phase leg
Trench + Field Stop IGBT3
P
ower Module
APTGT225A170G
APTGT225A170G – Rev 2 October, 2012
www.microsemi.com
2-6
All ratings @ T
j
= 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
I
CES
Zero Gate Voltage Collector Current V
GE
= 0V, V
CE
= 1700V 500 µA
T
j
= 25°C 2.0 2.4
V
CE(sat)
Collector Emitter Saturation Voltage
V
GE
= 15V
I
C
= 225A
T
j
= 125°C 2.4
V
V
GE(th)
Gate Threshold Voltage V
GE
= V
CE
, I
C
= 4mA 5.0 5.8 6.5 V
I
GES
Gate – Emitter Leakage Current V
GE
= 20V, V
CE
= 0V 600 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
C
ies
Input Capacitance 20
C
oes
Output Capacitance 0.8
C
res
Reverse Transfer Capacitance
V
GE
= 0V
V
CE
= 25V
f = 1MHz
0.66
nF
T
d(on)
Turn-on Delay Time 370
T
r
Rise Time 40
T
d(off)
Turn-off Delay Time 650
T
f
Fall Time
Inductive Switching (25°C)
V
GE
= 15V
V
Bus
= 900V
I
C
= 225A
R
G
= 3.3
180
ns
T
d(on)
Turn-on Delay Time 400
T
r
Rise Time 50
T
d(off)
Turn-off Delay Time 800
T
f
Fall Time
Inductive Switching (125°C)
V
GE
= 15V
V
Bus
= 900V
I
C
= 225A
R
G
= 3.3
300
ns
E
on
Turn-on Switching Energy T
j
= 125°C 72
E
off
Turn-off Switching Energy
V
GE
= 15V
V
Bus
= 900V
I
C
= 225A
R
G
= 3.3
T
j
= 125°C 70.5
mJ
Reverse diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
V
RRM
Maximum Peak Repetitive Reverse Voltage
1700 V
T
j
= 25°C 500
I
RM
Maximum Reverse Leakage Current V
R
=1700V
T
j
= 125°C 750
µA
I
F
DC Forward Current
Tc = 80°C 225 A
T
j
= 25°C 1.8 2.2
V
F
Diode Forward Voltage I
F
= 225A
T
j
= 125°C 1.9
V
T
j
= 25°C 385
t
rr
Reverse Recovery Time
T
j
= 125°C 490
ns
T
j
= 25°C 57
Q
rr
Reverse Recovery Charge
T
j
= 125°C 93
µC
T
j
= 25°C 26
E
r
Reverse Recovery Energy
I
F
= 225A
V
R
= 900V
di/dt =2400A/µs
T
j
= 125°C 52
mJ
APTGT225A170G
APTGT225A170G – Rev 2 October, 2012
www.microsemi.com
3-6
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
IGBT
0.1
R
thJC
Junction to Case Thermal Resistance
Diode 0.18
°C/W
V
ISOL
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
4000 V
T
J
Operating junction temperature range -40 150
T
STG
Storage Temperature Range -40 125
T
C
Operating Case Temperature -40 100
°C
To heatsink M6 3 5
Torque Mounting torque
For terminals M5 2 3.5
N.m
Wt Package Weight 300 g
SP6 Package outline (dimensions in mm)
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com

APTGT225A170G

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
IGBT Modules DOR CC6072
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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