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TDE1767DP
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
TDE1767 - TD
E1787
Mechan
ical data
13/16
8 Mechanical
data
In order to meet en
vironmental requirements
, ST off
ers these devices in ECOP
A
CK
®
pac
kages. These
packag
es hav
e a Lead-free second le
vel in
terconnect. The catego
r
y of
second Le
vel Interconnect
is marked on the pac
kage and on the inner bo
x label, in
compliance with JEDEC Standard
JESD97. The maximum ratin
gs related to soldering
conditions are also mark
ed on the inner bo
x
label. ECOP
A
CK is an ST trademark.
ECOP
ACK specifications are av
ailable at:
www
.st.com
.
Mechanical dat
a
TDE1767 - TDE1787
14/16
Figure 24.
Pa
cka
ge dimensions
T
able 5.
DIP-8 Mechanic
al data
Dim.
mm Inch
Min
T
yp
Max
Min
T
yp
Max
A 3.32
0.131
a1 0.51
0.020
B 1.15
1.65
0.045
0.065
b 0.356
0.55
0.014
0.022
b1
0.204 0.304
0.008 0.012
D 10.92
0.430
E 7.95
9.75
0.313
0.384
e 2.54
0.100
e3 7.62
0.
300
e4 7.62
0.
300
F 6.6
0.260
I 5.08
0.200
L 3.18
3.81
0.125 0.150
Z 1.52
0.060
TDE1767 - TDE1787
Revision hi
story
15/16
9 Re
vision
history
T
able 6.
Revision
histor
y
Date
Revision
C
hanges
20-Sep-2003
1
Initial release.
3-Mar-2007
2
Document reformatted, typo
Figure 1 on p
age 3
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
TDE1767DP
Mfr. #:
Buy TDE1767DP
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Single Relay/Lamp
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
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TDE1767ADP
TDE1767DP
TDE1787ADP
TDE1787DP