TDE1767 - TDE1787 Mechanical data
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8 Mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Mechanical data TDE1767 - TDE1787
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Figure 24. Package dimensions
Table 5. DIP-8 Mechanical data
Dim.
mm Inch
Min Typ Max Min Typ Max
A 3.32 0.131
a1 0.51 0.020
B 1.15 1.65 0.045 0.065
b 0.356 0.55 0.014 0.022
b1 0.204 0.304 0.008 0.012
D 10.92 0.430
E 7.95 9.75 0.313 0.384
e 2.54 0.100
e3 7.62 0.300
e4 7.62 0.300
F 6.6 0.260
I 5.08 0.200
L 3.18 3.81 0.125 0.150
Z 1.52 0.060
TDE1767 - TDE1787 Revision history
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9 Revision history
Table 6. Revision history
Date Revision Changes
20-Sep-2003 1 Initial release.
3-Mar-2007 2 Document reformatted, typo Figure 1 on page 3

TDE1767DP

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Single Relay/Lamp
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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