LTC3769
30
3769fa
For more information www.linear.com/LTC3769
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION
(WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
2423
1
2
BOTTOM VIEW—EXPOSED PAD
2.45 ±0.10
(4-SIDES)
0.75 ±0.05
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF24) QFN 0105 REV B
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.45 ±0.05
(4 SIDES)
3.10 ±0.05
PACKAGE
OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 ×
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697 Rev B)
FE20 (CA) TSSOP REV K 0913
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
RECOMMENDED SOLDER PAD LAYOUT
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1 3 4
5
6
7
8 9 10
DETAIL A
DETAIL A
111214 13
6.40 – 6.60*
(.252 – .260)
4.95
(.195)
2.74
(.108)
20 1918 17 16 15
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
2.74
(.108)
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
6.07
(.239)
6.07
(.239)
4.95
(.195)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
1.98
(.078)
REF
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation CA
0.56
(.022)
REF
DETAIL A IS THE PART OF
THE LEAD FRAME FEATURE
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
