A10101-02

global solutions:
local support
TM
Innovative Technology
for a Connected World
Tpli
TM
200 Series
Gap Filler
EXCEPTIONALLY SOFT, HIGHLY COMPRESSIBLE GAP FILLER
Tpli™ 200 is a premium gap ller. A unique blend of boron nitride and silicone
produce the highest performing interface pad.
Tpli™ 200’s exceptional combination of high thermal conductivity and compliancy
generate unmatched thermal resistances in a gap lling interface material.
Tpli™ 200 absorbs shock and relieves stresses, thus minimizing potential damage to
components. Tpli™ 200 is electrically insulating, stable from -45°C to 200°C, and
meets UL 94 HB rating.
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
APPLICATIONS
• Notebook computers
• Handheld portable electronics
• Micro heat pipe thermal solutions
• Micro processors, memory chips,
and graphic processors
• Automotive engine control modules
• Wireless communication hardware
FEATURES AND BENEFITS
• Thermal performance leader
• 6 W/mK thermal conductivity
• Soft and compliant
• Available in thicknesses from
0.010” - 0.200” (0.25mm - 5.0mm)
Innovative Technology
for a Connected World
Tpli
TM
200 Series
Gap Filler
THR-DS-Tpli-200 0710
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and ap-
plication of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness,
merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All
Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird
Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
A13519-00 Rev G, 2/05/07
STANDARD THICKNESSES
0.010” (0.25mm) 0.015” (0.38mm) 0.020” (0.51mm) 0.025” (0.64mm)
0.030” (0.76mm) 0.040” (1.02mm) 0.050” (1.27mm) 0.060” (1.52mm)
0.070” (1.78mm) 0.080” (2.03mm) 0.090” (2.29mm) 0.100” (2.54mm)
0.110” (2.79mm) 0.120” (3.05mm) 0.130” (3.30mm) 0.140” (3.56mm)
0.150” (3.81mm) 0.160” (4.06mm) 0.170” (4.32mm) 0.180” (4.57mm)
0.190” (4.83mm) 0.200” (5.08mm) Consult the factory for alternate thicknesses.
TPLI™ 210 TPLI™ 220 TPLI™ 240 TPLI™ 260 TPLI™ 2100 TEST METHOD
Construction &
Composition
Reinforced boron nitride
lled silicone elastomer
Boron nitride lled
silicone elastomer
Boron nitride lled
silicone elastomer
Boron nitride lled
silicone elastomer
Boron nitride lled
silicone elastomer
Color Rose Blue Yellow Grey Grey Visual
Thickness 0.010” (0.25mm) 0.020” (0.51mm) 0.040” (1.02mm) 0.060” (1.52mm) 0.100” (2.54mm)
Thickness Tolerance ± 0.001”
(± 0.025mm)
± 0.002”
(± 0.05mm)
± 0.003”
(± 0.08mm)
± 0.004”
(± 0.10mm)
± 0.007”
(± 0.18mm)
Density 1.44 g/cc 1.43 g/cc 1.43 g/cc 1.38 g/cc 1.36 g/cc Helium
Pycnometer
Hardness 75 Shore OO 70 Shore OO 70 Shore OO 70 Shore OO 70 Shore OO ASTM D2240
Tensile Strength N/A 35 psi 35 psi 20 psi 15 psi ASTM D412
% Elongation N/A 5 5 5 5 ASTM D412
Outgassing TML
(Post Cured)
0.08% 0.07% 0.07% 0.10% 0.15% ASTM E595
Outgassing CVCM
(Post Cured)
0.03% 0.02% 0.02% 0.04% 0.07% ASTM E595
UL Flammability Rating 94 HB 94 HB 94 HB 94 HB 94 HB E180840
Temperature Range -45°C to 200°C -45°C to 200°C -45°C to 200°C -45°C to 200°C -45°C to 200°C
Thermal Conductivity 6 W/mK 6 W/mK 6 W/mK 6 W/mK 6 W/mK ASTM D5470
(modied)
Thermal Impedance
@ 20 psi @ 138KPa
0.16°C - in
2
/W
1.03°C - cm
2
/W
0.21°C - in
2
/W
1.35°C - cm
2
/W
0.37°C - in
2
/W
2.45°C - cm
2
/W
0.49°C - in
2
/W
3.35°C - cm
2
/W
0.84°C - in
2
/W
5.81°C - cm
2
/W
ASTM D5470
(modied)
Thermal Expansion 51 ppm/C 123 ppm/C 72 ppm/C 72 ppm/C 96 ppm/C IPC-TM-650
2.4.24
Breakdown Voltage 1,000 Volts AC 4,000 Volts AC >5,000 Volts AC >5,000 Volts AC >5,000 Volts AC ASTM D149
Volume Resistivity 5 x 10
13
ohm-cm 5 x 10
13
ohm-cm 5 x 10
13
ohm-cm 5 x 10
13
ohm-cm 5 x 10
13
ohm-cm ASTM D257
Dielectric Constant
@ 1MHz
3.21 3.21 3.26 3.26 3.4 ASTM D150
STANDARD SHEET SIZES
8” x 8” (203mm x 203 mm) & 16” x 16” (406mm x 406mm). Tpli™ 200 may be die cut
into individual shapes.
PRESSURE SENSITIVE ADHESIVE
Request no adhesive with”AO” sufx. Request adhesive on one side with “A1” sufx.
Double sided adhesive is not available
REINFORCEMENT
Fiberglass is required in thicknesses of 0.010” (0.25mm) and 0.015” (0.38mm).
Reinforcement is optional in thicknesses 0.020” (0.5mm) and 0.025” (0.63mm).
Indicate berglass by “FG” sufx. Thicknesses above 0.025” (0.063mm) are
not reinforced.
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.

A10101-02

Mfr. #:
Manufacturer:
Laird Performance Materials
Description:
Thermal Interface Products Tpli 290 A1 8x8" 6 W/mK gap filler
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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