2N5061RLRAG

© Semiconductor Components Industries, LLC, 2011
September, 2011 Rev. 10
1 Publication Order Number:
2N5060/D
2N5060 Series
Sensitive Gate
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Annular PNPN devices designed for high volume consumer
applications such as relay and lamp drivers, small motor controls, gate
drivers for larger thyristors, and sensing and detection circuits.
Supplied in an inexpensive plastic TO92/TO-226AA package which
is readily adaptable for use in automatic insertion equipment.
Features
Sensitive Gate Trigger Current 200 mA Maximum
Low Reverse and Forward Blocking Current 50 mA Maximum,
T
C
= 110°C
Low Holding Current 5 mA Maximum
Passivated Surface for Reliability and Uniformity
These are PbFree Devices
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating
Symbol Value Unit
Peak Repetitive OffState Voltage (Note 1)
(T
J
= *40 to 110°C, Sine Wave,
50 to 60 Hz, R
GK
= 1 kW) 2N5060
2N5061
2N5062
2N5064
V
DRM,
V
RRM
30
60
100
200
V
On-State Current RMS (180° Conduction
Angles; T
C
= 80°C)
I
T(RMS)
0.8 A
*Average On-State Current
(180° Conduction Angles)
(T
C
= 67°C)
(T
C
= 102°C)
I
T(AV)
0.51
0.255
A
*Peak Non-repetitive Surge Current,
T
A
= 25°C (1/2 cycle, Sine Wave, 60 Hz)
I
TSM
10 A
Circuit Fusing Considerations (t = 8.3 ms) I
2
t 0.4 A
2
s
*Average On-State Current
(180° Conduction Angles) (T
C
= 67°C)
(T
C
= 102°C)
I
T(AV)
0.51
0.255
A
*Forward Peak Gate Power (Pulse Width v
1.0 msec; T
A
= 25°C)
P
GM
0.1 W
*Forward Average Gate Power
(T
A
= 25°C, t = 8.3 ms)
P
G(AV)
0.01 W
*Forward Peak Gate Current (Pulse Width
v 1.0 msec; T
A
= 25°C)
I
GM
1.0 A
*Reverse Peak Gate Voltage (Pulse Width
v 1.0 msec; T
A
= 25°C)
V
RGM
5.0 V
*Operating Junction Temperature Range T
J
40 to
+110
°C
*Storage Temperature Range T
stg
40 to
+150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. V
DRM
and V
RRM
for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
*Indicates JEDEC Registered Data.
SILICON CONTROLLED
RECTIFIERS
0.8 A RMS, 30 200 V
K
G
A
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
TO92
CASE 29
STYLE 10
50xx Specific Device Code
Y = Year
WW = Work Week
MARKING
DIAGRAM
2N
50xx
YWW
PIN ASSIGNMENT
1
2
3
Gate
Anode
Cathode
http://onsemi.com
1
2
3
2N5060 Series
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
*Thermal Resistance, JunctiontoCase (Note 2)
R
q
JC
75 °C/W
Thermal Resistance, JunctiontoAmbient
R
q
JA
200 °C/W
2. This measurement is made with the case mounted “flat side down” on a heatsink and held in position by means of a metal clamp over the
curved surface.
*Indicates JEDEC Registered Data.
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
*Peak Repetitive Forward or Reverse Blocking Current (Note 3)
(V
AK
= Rated V
DRM
or V
RRM
)T
C
= 25°C
T
C
= 110°C
I
DRM
, I
RRM
10
50
mA
mA
ON CHARACTERISTICS
*Peak Forward OnState Voltage (Note 4)
(I
TM
= 1.2 A peak @ T
A
= 25°C)
V
TM
1.7 V
Gate Trigger Current (Continuous DC) (Note 5)
*(V
AK
= 7.0 Vdc, R
L
= 100 W)T
C
= 25°C
T
C
= 40°C
I
GT
200
350
mA
Gate Trigger Voltage (Continuous DC) (Note 5) T
C
= 25°C
*(V
AK
= 7.0 Vdc, R
L
= 100 W)T
C
= 40°C
V
GT
0.8
1.2
V
*Gate NonTrigger Voltage
(V
AK
= Rated V
DRM
, R
L
= 100 W)T
C
= 110°C
V
GD
0.1
V
Holding Current (Note 3) T
C
= 25°C
*(V
AK
= 7.0 Vdc, initiating current = 20 mA) T
C
= 40°C
I
H
5.0
10
mA
Turn-On Time
Delay Time
Rise Time
(I
GT
= 1.0 mA, V
D
= Rated V
DRM
,
Forward Current = 1.0 A, di/dt = 6.0 A/ms
t
d
t
r
3.0
0.2
ms
Turn-Off Time
(Forward Current = 1.0 A pulse,
Pulse Width = 50 ms,
0.1% Duty Cycle, di/dt = 6.0 A/ms,
dv/dt = 20 V/ms, I
GT
= 1 mA) 2N5060, 2N5061
2N5062, 2N5064
t
q
10
30
ms
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of OffState Voltage
(Rated V
DRM
, Exponential, R
GK
= 1 kW)
dv/dt 30
V/ms
*Indicates JEDEC Registered Data.
3. R
GK
= 1000 W is included in measurement.
4. Forward current applied for 1 ms maximum duration, duty cycle p 1%.
5. R
GK
current is not included in measurement.
2N5060 Series
http://onsemi.com
3
+ Current
+ Voltage
V
TM
I
DRM
at V
DRM
I
H
Symbol Parameter
V
DRM
Peak Repetitive Off State Forward Voltage
I
DRM
Peak Forward Blocking Current
V
RRM
Peak Repetitive Off State Reverse Voltage
I
RRM
Peak Reverse Blocking Current
V
TM
Peak on State Voltage
I
H
Holding Current
Voltage Current Characteristic of SCR
Anode +
on state
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode
Forward Blocking Region
I
RRM
at V
RRM
(off state)
120
50
60
70
80
90
100
110
0 0.1 0.2 0.3 0.4
130
0.5
I
T(AV)
, AVERAGE ON‐STATE CURRENT (AMP)
a
dc
110
30
50
70
90
130
dc
a
0 0.1 0.2 0.3 0.4
I
T(AV)
, AVERAGE ON‐STATE CURRENT (AMP)
T
C
, MAXIMUM ALLOWABLE CASE TEMPERATURE ( C)
°
T
A
, MAXIMUM ALLOWABLE AMBIENT
°
TEMPERATURE ( C)
a = 30°
a = 30°
60°
90°
90°
120°
120°
180°
CASE MEASUREMENT
POINT - CENTER OF
FLAT PORTION
60°
180°
TYPICAL PRINTED
CIRCUIT BOARD
MOUNTING
a = CONDUCTION ANGLE
a = CONDUCTION ANGLE
Figure 1. Maximum Case Temperature Figure 2. Maximum Ambient Temperature
CURRENT DERATING

2N5061RLRAG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
THYRISTOR SCR 0.8A 60V TO92
Lifecycle:
New from this manufacturer.
Delivery:
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