TC1108-3.0VDBTR

TC1108
DS21357C-page 4 2002-2012 Microchip Technology Inc.
4.0 THERMAL CONSIDERATIONS
4.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
4.2 Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
AMAX
), the maximum allowable die temperature
(T
JMAX
) and the thermal resistance from junction-to-air
(
JA
).
EQUATION 4-2:
Table 4-1 shows various values of
JA
for the TC1108
versus board copper area.
TABLE 4-1: THERMAL RESISTANCE
GUIDELINES FOR TC1108
NOTE: *Tab of device attached to topside copper
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
V
INMAX
= 3.3V + 10%
V
OUTMIN
= 2.7V – 0.5%
I
LOADMAX
= 275mA
T
JMAX
= 125°C
T
AMAX
= 95°C
JA
= 59°C/W
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P
D
(V
INMAX
– V
OUTMIN
)I
LOADMAX
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10
–3
= 260mW
Maximum allowable power dissipation:
In this example, the TC1108 dissipates a maximum of
260mW; below the allowable limit of 508mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
V
IN
, is found by sustituting the maximum allowable
power dissipation of 508mW into Equation 4-1, from
which V
INMAX
= 4.6V.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
(
JA
)
2500 sq mm 2500 sq mm 2500 sq mm 45°C/W
1000 sq mm 2500 sq mm 2500 sq mm 45°C/W
225 sq mm 2500 sq mm 2500 sq mm 53°C/W
100 sq mm 2500 sq mm 2500 sq mm 59°C/W
1000 sq mm 1000 sq mm 1000 sq mm 52°C/W
1000 sq mm 0 sq mm 1000 sq mm 55°C/W
Where:
P
D
(V
INMAX
– V
OUTMIN
)I
LOADMAX
V
INMAX
V
OUTMIN
I
LOADMAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on V
IN
P
D
P
DMAX
= (T
JMAX
– T
AMAX
)
JA
Where all terms are previously defined.
2002-2012 Microchip Technology Inc. DS21357C-page 5
TC1108
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Output Noise
FREQUENCY (kHz)
NOISE (μV/HZ)
10.0
1.0
0.01
0.01 1
10
100 1000
0.1
0.0
R
LOAD
= 50Ω
C
OUT
= 1μF
0.012
0.010
0.008
0.004
0.002
0.000
-0.002
-0.004
0.006
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (
°
C)
Line Regulation
LINE REGULATION (%)
2.00
1.80
1.60
1.20
1.00
0.80
0.60
0.40
0.20
0.00
1.40
-40° -20° 0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (
°
C)
Load Regulation
LOAD REGULATION (%)
1 to 300mA
1 to 50mA
1 to 100mA
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0
50
100
150
200 250 300
LOAD CURRENT (mA)
DROPOUT VOLTAGE (V)
100.0
90.0
70.0
80.0
50.0
40.0
60.0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
Supply Current
SUPPLY CURRENT (μA)
3.075
3.025
2.925
2.975
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
V
OUT
vs. Temperature
V
OUT
(V)
12
5
°
C
8
85
°
C
C
7
0
°
C
2
5
°
C
0
°
C
C
-4
0
°
C
V
IN
= 4V
I
LOAD
= 100μA
C
LOAD
= 3.3μF
TC1108
DS21357C-page 6 2002-2012 Microchip Technology Inc.
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
“1” = part number code
“2” = represents temperature + date code + lot identity
+ subcontractor identity
6.2 Taping Form
TC1108 (V) Code
TC1108-2.5VDB 110825
TC1108-2.8VDB 110828
TC1108-3.0VDB 110830
TC1108-3.3VDB 110833
TC1108-5.0VDB 110850
Component Taping Orientation for 3-Pin SOT-223 Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
3-Pin SOT-223 12 mm 8 mm 4000 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
W
P

TC1108-3.0VDBTR

Mfr. #:
Manufacturer:
Microchip Technology
Description:
LDO Voltage Regulators 300mA LDO
Lifecycle:
New from this manufacturer.
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