MC74LCXU04DT

MC74LCXU04
http://onsemi.com
4
AC CHARACTERISTICS (t
R
= t
F
= 2.5 ns; R
L
= 500 W) (Note 3)
Symbol
Parameter Waveform
Limits
Units
T
A
= 40°C to +85°C
V
CC
= 3.3 V ± 0.3 V V
CC
= 2.7 V V
CC
= 2.5 V ± 0.2 V
C
L
= 50 pF C
L
= 50 pF C
L
= 30 pF
Min Max Min Max Min Max
t
PLH
t
PHL
Propagation Delay
Input to Output
1 1.0
1.0
3.6
3.6
1.0
1.0
4.5
4.5
1.0
1.0
4.3
4.3
ns
t
OSHL
t
OSLH
OutputtoOutput Skew
(Note 4)
1.0
1.0
ns
3. These AC parameters are preliminary and may be modified.
4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGHtoLOW (t
OSHL
) or LOWtoHIGH (t
OSLH
); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25°C
Symbol Characteristic Condition Min Typ Max Units
V
OLP
Dynamic LOW Peak Voltage
(Note 5)
V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V
V
CC
= 2.5 V, C
L
= 30 pF, V
IH
= 2.5 V, V
IL
= 0 V
0.8
0.6
V
V
OLV
Dynamic LOW Valley Voltage
(Note 5)
V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V
V
CC
= 2.5 V, C
L
= 30 pF, V
IH
= 2.5 V, V
IL
= 0 V
0.8
0.6
V
5. Number of outputs defined as “n”. Measured with “n1” outputs switching from HIGHtoLOW or LOWtoHIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
C
IN
Input Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
7 pF
C
OUT
Output Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
8 pF
C
PD
Power Dissipation Capacitance 10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
25 pF
ORDERING INFORMATION
Device Package Shipping
MC74LCXU04DG SOIC14
(PbFree)
55 Units / Rail
MC74LCXU04DR2G SOIC14
(PbFree)
2500 Tape & Reel
MC74LCXU04DTG TSSOP14
(PbFree)
96 Units / Rail
MC74LCXU04DTR2G TSSOP14
(PbFree)
2500 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC74LCXU04
http://onsemi.com
5
PROPAGATION DELAYS
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
V
CC
0 V
V
OH
V
OL
An
On
t
PLH
t
PHL
Vmi
Vmo Vmo
Vmi
Symbol
V
CC
3.3 V ± 0.3 V 2.7 V 2.5 V ± 0.2 V
Vmi 1.5 V 1.5 V V
CC
/2
Vmo 1.5 V 1.5 V V
CC
/2
Figure 3. AC Waveforms
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
C
L
C
L
= 50 pF at V
CC
= 3.3 ± 0.3 V or equivalent (includes jig and probe capacitance)
C
L
= 30 pF at V
CC
= 2.5 ± 0.2 V or equivalent (includes jig and probe capacitance)
R
L
= R
1
= 500 W or equivalent
R
T
= Z
OUT
of pulse generator (typically 50 W)
Figure 4. Test Circuit
MC74LCXU04
http://onsemi.com
6
PACKAGE DIMENSIONS
SOIC14 NB
CASE 751A03
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14
8
71
M
0.25 B
M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B
S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
A 1.35 1.75 0.054 0.068
b 0.35 0.49 0.014 0.019
L 0.40 1.25 0.016 0.049
e 1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M 0 7 0 7
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

MC74LCXU04DT

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Inverters 2-3.6V CMOS Hex
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union