2008-07-30 10
Version 1.0 SFH 3401
Pinning
Anschlussbelegung
Pin Description
Anschluss Beschreibung
1 collector / Kollektor
2base / Basis
3 emitter / Emitter
Method of Taping
Gurtung
Dimensions in mm (inch). / Maße in mm (inch).
Version 1.0 SFH 3401
2008-07-30 11
Recommended Solder Pad
Empfohlenes Lötpaddesign
Dimensions in mm. / Maße in mm.
Reflow Soldering Profile
Reflow-tprofil
Preconditioning: JEDEC Level 4 acc. to JEDEC J-STD-020D.01
OHF02393
1.8 2.4
1.3
1.8
Padgeometrie für
verbesserte Wärmeableitung
heat dissipation
Paddesign for improved
1
0.3
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
2008-07-30 12
Version 1.0 SFH 3401
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*
)
25 °C to 150 °C
2 3 K/s
Time t
S
T
Smin
to T
Smax
t
S
t
L
t
P
T
L
T
P
100 12060
10 20 30
80 100
217
23
245 260
36
Time
25 °C to T
P
Time within 5 °C of the specified peak
temperature T
P
- 5 K
Ramp-down rate*
T
P
to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*
)
T
Smax
to T
P
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480

SFH 3401-2/3-Z

Mfr. #:
Manufacturer:
OSRAM Opto Semiconductors
Description:
Phototransistors PHOTOTRANSISTOR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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