Table 11: Thermal Characteristics
Symbol Parameter/Condition Value Units Notes
T
C
Commercial operating case temperature 0 to 85 °C 1, 2, 3
T
C
>85 to 95 °C 1, 2, 3, 4
T
OPER
Normal operating temperature range 0 to 85 °C 5, 7
T
OPER
Extended temperature operating range (optional) >85 to 95 °C 5, 7
T
STG
Non-operating storage temperature –55 to 100 °C 6
RH
STG
Non-operating storage relative humidity (non-condensing) 5 to 95 %
NA Change rate of storage temperature 20 °C/hour
Notes:
1. Maximum operating case temperature; T
C
is measured in the center of the package.
2. A thermal solution must be designed to ensure the DRAM device does not exceed the
maximum T
C
during operation.
3. Device functionality is not guaranteed if the DRAM device exceeds the maximum T
C
dur-
ing operation.
4. If T
C
exceeds 85°C, the DRAM must be refreshed externally at 2X refresh, which is a 3.9µs
interval refresh rate.
5. The refresh rate must double when 85°C < T
OPER
≤ 95°C.
6. Storage temperature is defined as the temperature of the top/center of the DRAM and
does not reflect the storage temperatures of shipping trays.
7. For additional information, refer to technical note TN-00-08: "Thermal Applications"
available at micron.com.
16GB (x72, ECC, SR) 288-Pin DDR4 VLP RDIMM
Electrical Specifications
CCMTD-1725822587-9912
adf18c2gx72pz.pdf - Rev. F 4/17 EN
16
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
