SFH6345
www.vishay.com
Vishay Semiconductors
Rev. 2.2, 03-Aug-15
9
Document Number: 83680
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 13 - Tape and Reel Packing for SMD-8, Option 9 (1000 pieces on reel)
SOLDER PROFILES
Fig. 14 - Wave Soldering Double Wave Profile According to
J-STD-020 for DIP-8 Devices
Fig. 15 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for SMD-8 Devices
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: T
amb
< 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
L
C
SECTION X - X
Note:
• Cumulative tolerance of 10 sprocket holes is ± 0.20
SECTION Y - Y
Y
Y
XX
L
C
1.50
+ 0.25
- 0.00
1.50
+ 0.1
- 0.0
16.00
+ 0.3
- 0.1
7.50 ± 0.1
0.35 ± 0.05
3.81 ± 0.1
4.17 ± 0.1
1.75 ± 0.1
4.00 ± 0.1
2.00 ± 0.1
10.31 ± 0.1
12.00 ± 0.1 10.20 ± 0.1
2 K/s
second
wave
first wave
wave
ca. 5 K/s
5 s
full line: typical
dotted line:
process limits
Time (s)
Temperature (°C)
300
250
200
150
100
50
0
050100
150 200 250
94 8626
Lead temperature
235 °C to
260 °C
100 °C to
130 °C
ca. 200 K/s
forced cooling
ca. 2 K/s
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19841
255 °C
