VS-UFH60BA65
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Vishay Semiconductors
Revision: 25-Apr-2018
1
Document Number: 96135
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Insulated Single Phase Hyperfast Bridge
(Power Modules), 60 A
FEATURES
• Hyperfast and soft recovery characteristic
• Electrically isolated base plate
• Simplified mechanical designs, rapid assembly
• High operation junction temperature (T
J
max. = 175 °C)
• Designed and qualified for industrial and consumer level
• UL approved file E78996
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
The semiconductor in the SOT-227 package is isolated from
the copper base plate, allowing for common heatsinks and
compact assemblies to be built.
ELECTRICAL SPECIFICATIONS
PRIMARY CHARACTERISTICS
V
RRM
650 V
I
O
at T
C
= 123 °C 60 A
t
rr
63 ns
Type Modules - Bridge, Hyperfast
Package SOT-227
Circuit configuration Single phase bridge
ABSOLUTE MAXIMUM RATINGS
SYMBOL CHARACTERISTICS VALUES UNITS
I
O
60 A
T
C
123 °C
I
FSM
50 Hz 360
A
60 Hz 377
I
2
t
50 Hz 648
A
2
s
60 Hz 589
V
RRM
650 V
T
J
-55 to +175 °C
VOLTAGE RATINGS
TYPE NUMBER
VOLTAGE
CODE
V
RRM
, MAXIMUM REPETITIVE
PEAK REVERSE VOLTAGE
V
V
RSM
, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
I
RRM
MAXIMUM
AT T
J
MAXIMUM
mA
UFH60BA65 65 650 700 2
ELECTRICAL SPECIFICATIONS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode breakdown voltage V
BR
I
R
= 250 μA 650 - -
V
Forward voltage, per diode V
FM
I
F
= 60 A - 1.7 2.35
Reverse leakage current, per leg I
RM
V
R
= 650 V - 1.0 100
μA
V
R
= 650 V, T
J
= 150 °C - 250 -
RMS isolation voltage base plate V
ISOL
f = 50 Hz, any terminal to case, t = 1 min 2500 - - V