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MP33AB01

P1-P3P4-P6P7-P9P10-P12P13-P13
DocID24159 Rev 2 7/13
MP33AB01 Application recommendations
13
4 Application recommendations
Figure 3. MP33AB01 electrical connections and external component values
The DC-blocking capacitor C1 is required on the Vout pin as shown in Figure 3. The C1
value and the input resistance of the interface circuit (R) affect the cut-off frequency of the
Audio signal path as:
3 dB cut-off freq = 1 / 2S RC1
It's advisable to have a cut-off frequency well below 20 HZ, so for a typical input resistance
of about 20 k:it is recommended to use a C1 > 1 μF.
MP33AB01
Pin.4
Pin.1
Pin.2,3,5,6
+
Vdd
C1
C2 C3
(Ground)
R2
Typical values:
C1 > 1 μF
C2 ~ 1000 pF
C3 = 1 μF
(Vout )
-
R1
Vref
Ext. gain = (R1+R2) / R1
Vref
R
Package mechanical data MP33AB01
8/13 DocID24159 Rev 2
5 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Soldering information
The RHLGA (3.76 x 2.95) mm package is also compliant with the RoHS and “Green”
standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 4. Recommended soldering profile limits
Table 6. Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate T
L
to T
P
3 °C/sec max
Preheat
Minimum temperature
Maximum temperature
Time (T
SMIN
to T
SMAX
)
T
SMIN
T
SMAX
t
S
150 °C
200 °C
60 sec to 120 sec
Ramp-up rate T
SMAX
to T
L
Time maintained above liquidous temperature
Liquidous temperature
t
L
T
L
60 sec to 150 sec
217 °C
Peak temperature T
P
260 °C max
Time within 5 °C of actual peak temperature 20 sec to 40 sec
Ramp-down rate 6 °C/sec max
Time 25 °C (t25 °C) to peak temperature 8 minutes max
T25°C to PEAK
RAMP-DOWN
RAMP-UP
t
s
PREHEAT
t
L
t
p
CRITICAL ZONE
T
L
to T
P
T
SMAX
T
SMIN
TIME
T
P
T
L
TEMPERATURE
30 60 90 120 150 180 210 240 270 300 330 360 390
AM045166v1
DocID24159 Rev 2 9/13
MP33AB01 Package mechanical data
13
Figure 5. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package outline
D1
E1
A1
N2
L2
N1
L1
N3
L3
D2
G1
G2
d
P2
P1
R1
G5
E2
G3
E
D
C
K
K
D
K
E
K
C
K
Pin 1 Indicator
Pin 1 Indicator
G4
Pad 5
Pad 6
TOP VIEW
BOTTOM
VIEW
//
8233292_D
Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions
Symbol
mm inch.
Min. Typ. Max. Min. Typ. Max.
A1 0.900 1.000 1.100 0.0354 0.0394 0.0433
D1 3.660 3.760 3.860 0.1441 0.1480 0.1520
D2 0.600 0.750 0.900 0.0236 0.0295 0.0354
R1 0.200 0.250 0.300 0.0079 0.0098 0.0118
E1 2.850 2.950 3.050 0.1122 0.1161 0.1201
E2 1.325 1.475 1.625 0.0522 0.0581 0.0640
L1 2.690 2.740 2.790 0.1059 0.1079 0.1098
L2 1.882 1.932 1.982 0.0741 0.0761 0.0780
L3 1.981 2.031 2.181 0.0780 0.0800 0.0859
N1 1.300 1.350 1.400 0.0512 0.0531 0.0551
N2 0.916 0.966 1.116 0.0361 0.0380 0.0440
N3 0.965 1.015 1.065 0.0380 0.0400 0.0419
G1 0.673 0.723 0.763 0.0265 0.0285 0.0300
G2 0.512 0.562 0.612 0.0202 0.0221 0.0241
G3 0.562 0.612 0.662 0.0221 0.0241 0.0261
G4 0.562 0.612 0.662 0.0221 0.0241 0.0261
G5 1.174 1.224 1.274 0.0462 0.0482 0.0502
P1 1.680 1.730 1.780 0.0661 0.0681 0.0701
P2 1.275 1.325 1.375 0.0502 0.0522 0.0541
P1-P3P4-P6P7-P9P10-P12P13-P13

MP33AB01

Mfr. #:
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Manufacturer:
STMicroelectronics
Description:
MEMS Microphones MEMS Audio SM 125dBSPL 63dB
Lifecycle:
New from this manufacturer.
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