MP33AB01TR Datasheet MP33AB01, MP33AB01TR | P10-P12

Package mechanical data MP33AB01

10/13 DocID24159 Rev 2

Figure 6. Device footprint and PCB land pattern

d 0.150 0.0059

K 0.050 0.0020

Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions (continued)

Symbol

mm inch.

Min. Typ. Max. Min. Typ. Max.

DocID24159 Rev 2 11/13

MP33AB01 Package mechanical data

Figure 7. Recommended stencil openings

Revision history MP33AB01

12/13 DocID24159 Rev 2

6 Revision history

Table 8. Document revision history

Date Revision Changes

17-Jan-2013 1 Initial release

13-Sep-2013 2 Modified Figure 3 on page 7

Mfr. #:

Manufacturer:

STMicroelectronics

Description:

MEMS Microphones MEMS Audio SM 125dBSPL 63dB

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

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