VJ....31 / VJ....34 Automotive MLCC
www.vishay.com
Vishay Vitramon
Alternative Device Available, See GA....31G and GA....34G Automotive MLCC
Revision: 31-Jan-17
16
Document Number: 45040
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
3 - LOT ACCEPTANCE TESTS
Process tests available in classes (on request)
Upon request the records can be submitted in electronic format on monthly basis.
3.1 THERMAL STRENGTH, THERMAL SHOCK SENSIBILITY
Acceptance criteria: zero defects (IRATS and BIATS).
3.2 BOARD FLEX TEST
3.3 SOLDERABILITY/RESISTANCE TO SOLDERING HEAT
Temperature profile for reflow soldering of SMD parts IPC/JEDEC-J-STD-020C.
Test is done on a regular basis for samples taken randomly out of the line.
Acceptance criteria: at least 95 % new solder and no detachment or leaching of terminations.
4 - ENVIRONMENTAL REQUIREMENTS
A list of the chemical substances content, which must not be used or whose use shall be limited by international law, is available
on request.
Vishay confirms that the components specified in this specification do not contain asbestos nor cadmium, not even in the
smallest volumes.
The manufacturer/supplier confirms that the component during normal handling, storage and assembly, as well as during
operation in the automobile, is non toxic.
GROUP ACTION
A
Components are tested within the monitoring program of the supplier. The supplier shall submit the part numbers of the
selected component to the customer during the component specification discussions.
B Components (customer P/N) shall be tested quarterly. Records available only on special request by the customer.
C
Test with each shipment. Records are provided on a monthly basis.
Customer special requirement; requirement should be determined in a specific component specification.
Sample size 200
Handling Mounted on PCB
Thermal shock 1 x 280 °C, no pre-heat, 5 s to 10 s
IR - test (IRATS) U = U
R
, T = room temperature, verified
Burn in (BIATS)
Equivalent to 12 h burn-in,
2 x U
R
/125 °C,
verification time to failure
Sample size 20 pcs/lot
X7R, X8R Every lot
C0G At least three different part numbers of one component family matrix per quarter
Max. deflection 8 mm (data to be reported, available on request)
VJ....31 / VJ....34 Automotive MLCC
www.vishay.com
Vishay Vitramon
Alternative Device Available, See GA....31G and GA....34G Automotive MLCC
Revision: 31-Jan-17
17
Document Number: 45040
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
5 - INSPECTION CRITERIA
The supplier shall carry out visual examination with suitable equipment with approximately 10 x magnification and lighting
appropriate to the specimen under test and the required quality level.
Chipping
The components shall be free of cracks or fissures. Small damages which do not deteriorate the performance of the component
shall be less than 50 % of the surface of the MLCC as defined in EIA 595.
Delamination or Exposed Electrodes
No visible separation or delamination between layers of the capacitor and no exposed electrodes between the two terminals of
the capacitor must be seen.
Metallization
For the metallization, no visible detachment of the metallized terminals and no exposed electrodes must be seen. Defects and
gaps in the metallization on each sides of the terminal must not exceed 10 % of the total area (e.g. A, B, C, …). Leaching shall
not exceed 25 %.
Electrode Distance
The ceramic body shall be free of any conducting material between the terminals which reduces the distance of the electrodes.
The minimum distance “D” is 400 μm for all package sizes, except 0402. For the component package 0402 the minimum
distance is 200 μm.
C
A
B
D
VJ....31 / VJ....34 Automotive MLCC
www.vishay.com
Vishay Vitramon
Alternative Device Available, See GA....31G and GA....34G Automotive MLCC
Revision: 31-Jan-17
18
Document Number: 45040
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
6 - BOARD FLEX TEST CONDITIONS
6.1 BOARD FLEX DEFINITIONS OF TEST
PCB thickness = (1.6 ± 0.1) mm
Copper thickness = 35 μm
Material FR4 (EP-GC 02 according to DIN 40 802)
Note
LL = total length; LB = width of the pad; LEL = single pad length
6.2 SOLDERING INSTRUCTIONS
6.3 TYPICAL TEMPERATURE PROFILE FOR REFLOW SOLDERING (Boardflex test)
LAYOUT/PAD DESIGN (Dimensions in mm)
CASE CODE
PAD SIZE
LL LB LEL
0603 2.20 1.00 0.75
0805 3.40 1.30 1.20
1206 4.50 1.80 1.20
1210 4.50 2.80 1.30
1812 4.75 3.60 1.50
LEL
LL
LB
THICKNESS, RECOMMENDED FOR SOLDER PASTE (Reflow soldering)
CASE CODE THICKNESS in μm
0402 75 to 90
0603 150 to 200
0805 150 to 200
1206 150 to 200
1210 150 to 200
1812 150 to 200
TEMPERATURE (°C)
300
250
200
150
100
0 50 100 150 200 250 300 350 400
TIME (s)
LEAD (Pb)-FREE SOLDERING PROFILE
MIN. 300 s
MAX. 260 °C
MIN. 255 °C
T (SOLID) MIN. 217 °C
MIN. 190 °C
MIN. 40 s
MIN. 90 s
RAMP UP
TO 150 °C
MAX. 3 K/s
RAMP DOWN
FROM T (SOLID)
MAX. 6 K/s
MIN. 110 s
50
0

VJ0603Y102KXAAC31

Mfr. #:
Manufacturer:
Vishay
Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 0603 1000pF 50volts X7R 10%
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union