NCV7513
http://onsemi.com
22
APPLICATION GUIDELINES
General
Unused DRN
X
inputs should be connected to V
CC1
to
prevent false open load faults. Unused parallel inputs
should be connected to GND and unused enable inputs
should be connected to V
CC1
. The mask bit for each unused
channel should be ‘set’ (see Table 5) to prevent activation
of the flags and the users software should be designed to
ignore fault information for unused channels. For best
shortedload detection accuracy, the external MOSFET
source terminals should be starconnected and the
NCV7513’s GND pin, and the lower resistor in the fault
reference voltage divider should be Kelvin connected to
the star (see Figures 2 and 13).
Consideration of autoretry fault recovery behavior is
necessary from a power dissipation viewpoint (for both the
NCV7513 and the MOSFETs) and also from an EMI
viewpoint.
Driver slew rate and turnon/off symmetry can be
adjusted externally to the NCV7513 in each channel’s gate
circuit by the use of series resistors for slew control, or
resistors and diodes for symmetry. Any benefit of EMI
reduction by this method comes at the expense of increased
switching losses in the MOSFETs.
The channel fault blanking timers must be considered
when choosing external components (MOSFETs, slew
control resistors, etc.) to avoid false faults. Component
choices must ensure that gate circuit charge/discharge
times stay within the turnon/turnoff blanking times.
The NCV7513 does not have integral draingate flyback
clamps. Clamp MOSFETs, such as ON Semiconductor’s
NID9N05CL, are recommended when driving unclamped
inductive loads. This flexibility allows choice of MOSFET
clamp voltages suitable to each application.
DRN
X
Feedback Resistor
Each DRN
X
feedback input has a clamp to keep the
applied voltage below the breakdown voltage of the
NCV7513. An external series resistor (R
DX
) is required
between each DRN
X
input and MOSFET drain. Channels
may be clamped sequentially or simultaneously but total
clamp power is limited to the maximum allowable junction
temperature.
To limit power in the DRN
X
input clamps and to ensure
proper open load or short to GND detection, the R
DX
resistor must be dimensioned according to the following
constraint equations:
R
DX(MIN)
+
V
PK
V
CL(MIN)
I
CL(MAX)
(eq. 2)
R
DX(MAX)
+
V
SG
|
V
OS
|
|
I
SG
|
(eq. 3)
where V
PK
is the peak transient drain voltage, V
CL
is the
DRN
X
input clamp voltage, I
CL(MAX)
is the input clamp
current, and V
SG
and I
SG
are the respective short to GND
fault detection voltage and diagnostic current, and V
OS
is
the allowable offset (1.0 V max) between the NCV7513’s
GND and the short.
Once R
DX
is chosen, the open load and short to GND
detection resistances in the application can be predicted:
R
OL
w
V
LOAD
V
OL
I
OL
* R
DX
(eq. 4)
R
SG
v
R
LOAD
(V
SG
" V
OS
|
I
SG
|
R
DX
)
V
LOAD
V
SG
)
|
I
SG
|
(R
DX
) R
LOAD
)
(eq. 5)
Using the data sheet values for V
CL(MIN)
= 27 V,
I
CL(MAX)
= 10 mA, and choosing V
PK
= 55 V as an
example, Equation 2 evaluates to 2.8 kW minimum.
Choosing V
CC1
= 5.0 V and using the typical data sheet
values for V
SG
= 30%V
CC1
, I
SG
= 20 mA, and choosing
V
OS
= 0, Equation 3 evaluates to 75 kW maximum.
Selecting R
DX
= 6.8 kW "5%, V
CC1
= 5.0 V, V
LOAD
=
12.0 V, V
OS
= 0 V, R
LOAD
= 555 W, and using the typical
data sheet values for V
OL
, I
OL
, V
SG
, and I
SG
, Equation 4
predicts an open load detection resistance of 130.7 kW and
Equation 5 predicts a short to GND detection resistance of
71.1 W. When R
DX
and the data sheet values are taken to
their extremes, the open load detection range is 94.1 kW v
R
OL
v 273.5 kW, and the short to GND detection range is
59.2 W v R
SG
v 84.4 W.
NCV7513
http://onsemi.com
23
PACKAGE DIMENSIONS
32 LEAD LQFP
CASE 873A02
ISSUE C
DETAIL Y
A
S1
VB
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
N
J
DF
METAL
SECTION AEAE
G
SEATING
PLANE
R
Q
_
W
K
X
0.250 (0.010)
GAUGE PLANE
E
C
H
DETAIL AD
DETAIL AD
A1
B1
V1
4X
S
4X
9
T
Z
U
T-U0.20 (0.008) ZAC
T-U0.20 (0.008) ZAB
0.10 (0.004) AC
AC
AB
M
_
8X
T, U, Z
T-U
M
0.20 (0.008) ZAC
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE
DETERMINED AT DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
DIM
A
MIN MAX MIN MAX
INCHES
7.000 BSC 0.276 BSC
MILLIMETERS
B 7.000 BSC 0.276 BSC
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC 0.031 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.450 0.750 0.018 0.030
M 12 REF 12 REF
N 0.090 0.160 0.004 0.006
P 0.400 BSC 0.016 BSC
Q 1 5 1 5
R 0.150 0.250 0.006 0.010
V 9.000 BSC 0.354 BSC
V1 4.500 BSC 0.177 BSC
__
___ _
B1 3.500 BSC 0.138 BSC
A1 3.500 BSC 0.138 BSC
S 9.000 BSC 0.354 BSC
S1 4.500 BSC 0.177 BSC
W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
NCV7513/D
FLEXMOS and SMARTDISCRETES are trademarks of Semiconductor Components Industries, LLC (SCILLC).
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
a
Sales Representative

NCV7513FTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Gate Drivers ANA HEX LOW-SIDE PRE DRIV
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet