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532AC000127DGR

P1-P3P4-P6P7-P9P10-P12
Si532
4 Rev. 1.4
Table 4. CLK± Output Phase Jitter
Parameter Symbol Test Condition Min Typ Max Units
Phase Jitter (RMS)
1
for F
OUT
> 500 MHz
J
12 kHz to 20 MHz (OC-48) — 0.25 0.40 ps
50 kHz to 80 MHz (OC-192) — 0.26 0.37 ps
Phase Jitter (RMS)
1
for F
OUT
of 125 to 500 MHz
J
12 kHz to 20 MHz (OC-48) — 0.36 0.50 ps
50 kHz to 80 MHz (OC-192)
2
— 0.34 0.42 ps
Phase Jitter (RMS)
1
for F
OUT
of 125 and 156.25 MHz Only
J
12 kHz to 20 MHz (Brickwall) — 0.25 0.40 ps
Phase Jitter (RMS)
for F
OUT
of 10 to 160 MHz
CMOS Output Only
J
12 kHz to 20 MHz (OC-48)
2
—0.62 — ps
50 kHz to 20 MHz
2
—0.61 — ps
Notes:
1. Refer to AN256 for further information.
2. Max offset frequencies: 80 MHz for FOUT >
250 MHz, 20 MHz for 50 MHz < FOUT <250 MHz,
2MHz for 10MHz < FOUT <50 MHz.
Table 5. CLK± Output Period Jitter
Parameter Symbol Test Condition Min Typ Max Units
Period Jitter*
J
PER
RMS — 2 — ps
Peak-to-Peak — 14 — ps
*Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information.
Table 6. CLK± Output Phase Noise (Typical)
Offset Frequency (f) 120.00 MHz
LVDS
156.25 MHz
LVPECL
622.08 MHz
LVPECL
Units
100 Hz
1kHz
10 kHz
100 kHz
1MHz
10 MHz
100 MHz
–112
–122
–132
–137
–144
–150
n/a
–105
–122
–128
–135
–144
–147
n/a
–97
–107
–116
–121
–134
–146
–148
dBc/Hz
Si532
Rev. 1.4 5
Table 7. Environmental Compliance
The Si532 meets the following qualification test requirements.
Parameter Conditions/Test Method
Mechanical Shock
MIL-STD-883, Method 2002
Mechanical Vibration
MIL-STD-883, Method 2007
Solderability
MIL-STD-883, Method 2003
Gross & Fine Leak
MIL-STD-883, Method 1014
Resistance to Solder Heat
MIL-STD-883, Method 2036
Moisture Sensitivity Level
J-STD_020, MSL1
Contact Pads
Gold over Nickel
Table 8. Thermal Characteristics
(Typical values TA = 25 ºC, V
DD
=3.3V)
Parameter Symbol Test Condition Min Typ Max Unit
Thermal Resistance Junction to Ambient
JA
Still Air — 84.6 — °C/W
Thermal Resistance Junction to Case
JC
Still Air — 38.8 — °C/W
Ambient Temperature T
A
–40 — 85 °C
Junction Temperature T
J
——125°C
Table 9. Absolute Maximum Ratings
1
Parameter Symbol Rating Units
Maximum Operating Temperature
T
AMAX
85 ºC
Supply Voltage, 1.8 V Option
V
DD
–0.5 to +1.9 V
Supply Voltage, 2.5/3.3 V Option
V
DD
–0.5 to +3.8 V
Input Voltage (any input pin)
V
I
–0.5 to V
DD
+ 0.3 V
Storage Temperature
T
S
–55 to +125 ºC
ESD Sensitivity (HBM, per JESD22-A114)
ESD 2500 V
Soldering Temperature (Pb-free profile)
2
T
PEAK
260 ºC
Soldering Temperature Time @ T
PEAK
(Pb-free profile)
2
t
P
20–40 seconds
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at
www.silabs.com/VCXO for further information, including soldering profiles.
Si532
6 Rev. 1.4
2. Pin Descriptions
Table 10. Pin Descriptions
Pin Symbol LVDS/LVPECL/CML Function CMOS Function
1FS*
Frequency Select
0 = First frequency selected
1 = Second frequency selected
Frequency Select
0 = First frequency selected
1 = Second frequency selected
2OE*
Output enable
0 = clock output disabled (outputs tristated)
1 = clock output enabled
Output enable
0 = clock output disabled (outputs tristated)
1 = clock output enabled
3 GND Electrical and Case Ground Electrical and Case Ground
4 CLK+ Oscillator Output Oscillator Output
5 CLK– Complementary Output No connection
6V
DD
Power Supply Voltage Power Supply Voltage
*Note: FS and OE include a 17 k pullup resistor to V
DD
. See Section 3. “Ordering Information” for details on frequency value
ordering.
(Top View)
LVDS/LVPECL/CML
CMOS
P1-P3P4-P6P7-P9P10-P12

532AC000127DGR

Mfr. #:
Buy 532AC000127DGR
Manufacturer:
Silicon Labs
Description:
XTAL OSC XO 3.3V 6SMD
Lifecycle:
New from this manufacturer.
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