ADT7485AARMZ-R

ADT7485A
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10
biased above ground by an internal diode at the D1 input.
If the sensor is operating in an extremely noisy environment,
C1 can be added as a noise filter. Its value should not exceed
1,000 pF.
Figure 15. Signal Conditioning for Remote Diode Temperature Sensors
LOW-PASS FILTER
f
C
= 65 kHz
REMOTE
SENSING
TRANSISTOR
BIAS
DIODE
D1+
D1
V
CC
I
BIAS
I N2 I
V
OUT+
V
OUT
To ADC
C1*
*CAPACITOR C1 IS OPTIONAL. IT SHOULD ONLY BE USED IN NOISY ENVIRONMENTS.
N1 I
To measure DV
BE
, the operating current through the
sensor is switched between three related currents. Figure 15
shows N1 I and N2 I as different multiples of the
current I. The currents through the temperature diode are
switched between I and N1 I, giving DV
BE1
, and then
between I and N2 I, giving DV
BE2
. The temperature can
then be calculated using the two DV
BE
measurements. This
method can also cancel the effect of series resistance on the
temperature measurement. The resulting DV
BE
waveforms
are passed through a 65 kHz low-pass filter to remove noise
and then through a chopper-stabilized amplifier to amplify
and rectify the waveform, producing a dc voltage
proportional to DV
BE
. The ADC digitizes this voltage, and
a temperature measurement is produced. To reduce the
effects of noise, digital filtering is performed by averaging
the results of 16 measurement cycles for low conversion
rates. Signal conditioning and measurement of the internal
temperature sensor is performed in the same manner.
Reading Temperature Measurements
The temperature data returned is two bytes in little endian
format, that is, LSB before MSB. All temperatures can be
read together by using Command Code 0x00 with a read
length of 0x04. The command codes and returned data are
described in Table 14.
Table 14. TEMPERATURE CHANNEL COMMAND
CODES
Temp
Channel
Command
Code
Returned Data
Internal 0x00 LSB, MSB
External 0x01 LSB, MSB
All Temps 0x00 Internal LSB, Internal MSB;
External LSB, External MSB
SST Temperature Sensor Data Format
The data for temperature is structured to allow values in
the range of 512C to be reported. Thus, the temperature
sensor format uses a twos complement, 16-bit binary value
to represent values in this range. This format allows
temperatures to be represented with approximately a
0.016C resolution.
Table 15. SST TEMPERATURE DATA FORMAT
Temperature (5C)
Twos Complement
MSB LSB
125 1110 0000 1100 0000
80 1110 1100 0000 0000
40 1111 0110 0000 0000
20 1111 1011 0011 1110
5 1111 1110 1100 0000
1 1111 1111 1100 0000
0 0000 0000 0000 0000
+1 0000 0000 0100 0000
+5 0000 0001 0100 0000
+20 0000 0100 1100 0010
+40 0000 1010 0000 0000
+80 0001 0100 0000 0000
+125 0001 1111 0100 0000
Using Discrete Transistors
If a discrete transistor is used, the collector is not grounded
and should be linked to the base. If a PNP transistor is used,
the base is connected to the D input and the emitter is
connected to the D+ input. If an NPN transistor is used, the
emitter is connected to the D input and the base is
connected to the D+ input.
Figure 16 shows how to connect the ADT7485A to an NPN
or PNP transistor for temperature measurement. To prevent
ground noise from interfering with the measurement, the
more negative terminal of the sensor is not referenced to
ground, but is biased above ground by an internal diode at the
D1 input.
ADT7485A
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11
Figure 16. Connections for NPN and PNP Transistors
ADT7485A
D1+
D1
2N3904
NPN
ADT7485A
D1+
D1
2N3906
PNP
The ADT7485A shows an external temperature value of
0x8000 if the external diode is an open or short circuit.
Layout Considerations
Digital boards can be electrically noisy environments.
Take the following precautions to protect the analog inputs
from noise, particularly when measuring the very small
voltages from a remote diode sensor:
1. Place the ADT7485A as close as possible to the
remote sensing diode. Provided that the worst
noise sources, such as clock generators,
data/address buses, and CRTs, are avoided, this
distance can be four to eight inches.
2. Route the D1+ and D1 tracks close together in
parallel with grounded guard tracks on each side.
Provide a ground plane under the tracks if
possible.
3. Use wide tracks to minimize inductance and
reduce noise pickup. A 5 mil track minimum width
and spacing is recommended.
Figure 17. Arrangement of Signal Tracks
5 MIL
5 MIL
5 MIL
5 MIL
5 MIL
5 MIL
5 MIL
GND
D1
D1+
GND
4. Try to minimize the number of copper/solder
joints, which can cause thermocouple effects.
Where copper/solder joints are used, make sure
that they are in both the D1+ and D1 paths and
are at the same temperature.
5. Thermocouple effects should not be a major
problem because 1C corresponds to about
240 mV, and thermocouple voltages are about
3 mV/C of the temperature difference. Unless
there are two thermocouples with a big
temperature differential between them,
thermocouple voltages should be much less than
200 mV.
6. Place a 0.1 mF bypass capacitor close to the
ADT7485A.
7. If the distance to the remote sensor is more than
eight inches, the use of a twisted pair cable is
recommended. This works for distances of about
6 feet to 12 feet.
8. For very long distances (up to 100 feet), use
shielded twisted pair cables, such as Belden #8451
microphone cables. Connect the twisted pair cable
to D+ and D and the shield to GND, close to the
ADT7485A. Leave the remote end of the shield
unconnected to avoid ground loops.
Because the measurement technique uses switched
current sources, excessive cable and/or filter capacitance
can affect the measurement. When using long cables, the
filter capacitor can be reduced or removed. Cable resistance
can also introduce errors. A 1 W series resistance introduces
about 0.5C error.
Temperature Offset
As CPUs run faster, it is more difficult to avoid high
frequency clocks when routing the D+ and D tracks around
a system board. Even when the recommended layout
guidelines are followed, there may still be temperature
errors, attributed to noise being coupled onto the D+ and D
lines. High frequency noise generally has the effect of
producing temperature measurements that are consistently
too high by a specific amount. The ADT7485A has
temperature offset command code of 0xe0 through which a
desired offset can be set. By doing a one-time calibration of
the system, the offset caused by system board noise can be
calculated and nulled by specifying it in the ADT7485A.
The offset is automatically added to every temperature
measurement. The maximum offset is 128C with 0.25C
resolution. The offset format is the same as the temperature
data format; 16-bit, twos complement notation, as shown in
Table 15. The offset should be programmed in little endian
format, that is, LSB before MSB. The offset value is also
returned in little endian format when read.
Table 16. ORDERING INFORMATION
Device Order Number* Package Type Package Option Shipping
ADT7485AARMZR 10-lead MSOP RM10 3,000 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This is Pb-Free package.
ADT7485A
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12
PACKAGE DIMENSIONS
MSOP10
CASE 846AC01
ISSUE O
S
B
M
0.08 (0.003) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.114 0.122
B 2.90 3.10 0.114 0.122
C 0.95 1.10 0.037 0.043
D 0.20 0.30 0.008 0.012
G 0.50 BSC 0.020 BSC
H 0.05 0.15 0.002 0.006
J 0.10 0.21 0.004 0.008
K 4.75 5.05 0.187 0.199
L 0.40 0.70 0.016 0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846B01 OBSOLETE. NEW STANDARD
846B02
B
A
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
T
SEATING
PLANE
C
H
J
L
ǒ
mm
inches
Ǔ
SCALE 8:1
10X 10X
8X
1.04
0.041
0.32
0.0126
5.28
0.208
4.24
0.167
3.20
0.126
0.50
0.0196
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages.Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
ADT7485A/D
SST is a licensable bus technology from Analog Devices, Inc., and Intel Corporation.
LITERATURE FULFILLMENT:
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P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
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Sales Representative

ADT7485AARMZ-R

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Board Mount Temperature Sensors TMP SNSR/VLTG MON W/SST INTERFACE
Lifecycle:
New from this manufacturer.
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