RELIABILITY SPECIFICATION
ENVIRONMENTAL:
a) THERMAL SHOCK: MIL-STD-883, Method 1011, Condition A
b) MOISTURE RESISTANCE: MIL-STD-883, Method 1004
c) VIBRATION: MIL-STD-883, Method 2007, Condition A
d) RESISTANCE TO SOLDERING HEAT: J-STD-020D Table 5-2 Pb-free devices
(except 2 cycles max)
e) HAZARDOUS SUBSTANCE: Pb - free and RoHS Compliant.
MECHANICAL:
a) SHOCK: MIL-STD-883, Method 2002, Condition B
b) SOLDERABILITY: JESD22-B102-D Method 2 (Preconditioning E)
c) TERMINAL STRENGTH: MIL-STD-883, Method 2004, Test Condition D
d) GROSS LEAK: MIL-STD-883, Method 1014, Condition C
e)
FINE LEAK: MIL-STD-883, Method 1014, Condition A2, R1=2x10
-8
atm cc/s
f) SOLVENT RESISTANCE: MIL-STD-202, Method 215
SUGGESTED IR REFLOW PROFILE
*As per IPC-JEDEC J-STD-020D
For soldering reflow profile and reliability test ratings go to: http://www.pericom.com/pdf/sre/reflow.pdf
FK2400017
VER. B 13-Apr-11
TYPE FK 3.2x2.5 SEAM SEALED CRYSTAL CLOCK OSCILLATOR
E0-R-4-014 Rev. E Page 3
